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Meeting 2022 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXI
Presentation Title Room-temperature Electrochemical Healing of Difficult-to-weld Metallic Materials
Author(s) James H. Pikul
On-Site Speaker (Planned) James H. Pikul
Abstract Scope Healing structural metals has long required high temperature techniques that are energy expensive and result in cracking in many nickel and aluminum alloys. We show that we can overcome this by repairing metal at room temperature using selective electrochemical deposition. We combine theory and experiments to predict the fracture mode of healed samples and the possibility of achieving 100% recovery of tensile strength. The insights of this model allow us to demonstrate the healing of hard-to-weld alloys, aluminum 2024 and aluminum 7075, with 85% and 100% recovery of tensile strength respectively. This design strategy also allows us to demonstrate full recovery of tensile strength in the 3D printed cellular structures. This work establishes a general framework for the room-temperature electrochemical healing of a variety of structural metallic materials. It opens the possibility of repairing metals, that are otherwise difficult to weld, in structures and robots to extend their operational life and to efficiently employ resources in energy-constrained systems and remote environments.
Proceedings Inclusion? Planned:

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

A Critical Analysis of Joining Processes for NiTi Shape Memory Alloys
Ab Initio Interfacial Stability and Cu-segregation Effect upon η’ and η2 Precipitates in Al-Zn-Mg-Cu Alloys
Bi Orientation-dependence and Mechanical Properties in a Sn-Bi-Ag Low-temperature Lead-free Solder
Comparison of NiCo and NiP Electroplating for Wear Resistant Probe Tip
Cu Sintering Process Modified by Adding a Low Temperature Liquid Sintering Step
Data-driven Rational Design of Conductive Copper-based Alloys with High Performance
Design of Multifunctional Architected Materials
Effect of Vertical Interfaces on Phase Transformation Behavior of MoS2
Electric Current-assisted Treatment for 7075 Aluminum Alloy to Withstand High-speed Impact
Electronic Material Properties Exploration Using Machine Learning: In Effective Charge, Hardness, and Dissipation Factor
Failure Analysis and Prediction of Solder Microbumps due to Side Wetting and Electromigration by 3D X-ray
Filp-chip Encapsulation with Hybrid Organic-inorganic Passivation of Perovskite Solar Cells
Interfacial Reaction between In Coated Cu Sheet and ENIG Substrate
Interfacial Reaction between Sn-rich Solder and FeCoNiCu High-entropy Alloy
Interfacial Reactions between Sn-0.7 Cu Alloys C194, Alloy25, and C1990 Substrates
Interfacial Reactions in the Sn/C194 and Sn-3.0Ag-0.5Cu/C194 Couples
Investigation of Thermal Properties and Thermal Reliability of Ga-based Low Melting Temperature Alloys as Thermal Interface Materials (TIMs)
Linked Metamaterials with Adaptable Stiffness
Mechanical Performance of Advanced Multicomponent Solder Alloy under Thermal Aging
Mesoscale Simulations Guiding Data-driven Design of Electronic Materials
Morphological Effect of Patterned Sapphire Substrate on Efficiency of White-light Phosphor LED Package
Novel Zr-based Alloy with Low Young's Modulus and Magnetic Susceptibility for Biomedical Implants
NOW ON-DEMAND ONLY - The Influence of Morphology in Ultrathin Ag Structure on ZnO/Ag/ZnO Transmittance Grown by Sputtering Compared with Simulation
Phase Transformation Temperatures of Sn-based Solder Alloys
Role of Composition in the Phase Transition of Ge-Sb-Te Alloys
Room-temperature Electrochemical Healing of Difficult-to-weld Metallic Materials
Self-healing Kirkendall Voids at the Joint Interface between Sn and <111> Oriented and Nano-twinned Cu
Self-healing of Fiber-composite Laminates via In Situ Thermal Remending
Solution-processed Perovskite Photoabsorbers with Mixed Cations for Improved Stability in Solar Cells
Study of Ferroelectricity and Phase Transitions in Hafnia
The Challenge of Machine Learning the Stability of Materials
Using Solid-liquid Phase Transformation in Fusible Metals as a Self-healing Mechanism for Next Generation Metal-ion Battery Anodes
Vat Polymerization of Adaptable and Reconfigurable Three-dimensional (3D) Micro-architected Materials

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