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Meeting 2022 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXI
Presentation Title Interfacial Reactions in the Sn/C194 and Sn-3.0Ag-0.5Cu/C194 Couples
Author(s) Yee-Wen Yen, Jun Wen, You-Yan Li, Xin-Bin Hu
On-Site Speaker (Planned) You-Yan Li
Abstract Scope The solid/liquid couple technique is used to investigate the interfacial reactions in the Sn/C194 (Cu-2.3Fe-0.12Zn-0.03P, in wt.%) and Sn-3.0Ag-0.5Cu (SAC)/C194 couples at 240 to 270 C for 0.5 to 8 h. Only the (Cu,Fe)6Sn5 phase is formed at the Sn/C194 interface at 240C, and the (Cu,Fe)6Sn5 and (Cu,Fe)3Sn phases were formed at 255 and 270C. Only the (Cu,Fe)6Sn5 phase is formed in the SAC/C194 couple reacted at 240 and 255C. When the reaction temperature was increased to 270C, both (Cu,Fe)6Sn5 and (Cu,Fe)3Sn phases were observed at the interface. The intermetallic phase dispersion distance in the Sn/C194 and SAC/C194 couples was increased with the increase of reaction temperatures and times. Due to the dissolution of Fe atoms and providing the heterogeneous nucleation site in the molten solders, the micro-island shaped of the (Cu,Fe)6Sn5 phase was observed in these two couples.
Proceedings Inclusion? Planned:

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