About this Abstract |
Meeting |
2022 TMS Annual Meeting & Exhibition
|
Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXI
|
Presentation Title |
Cu Sintering Process Modified by Adding a Low Temperature Liquid Sintering Step |
Author(s) |
Bo Rong Huang |
On-Site Speaker (Planned) |
Bo Rong Huang |
Abstract Scope |
Thick film technology is currently used to manufacture resistors, dielectric layers or conductive lines. In today's world, thick films are more widely used in high-power applications and passive components with thick film electrodes or substrates, such as low-level cofired ceramics (LTCC) and direct bonding copper (DBC). Therefore, there has a great significance for the industry to study the evolution of microstructure in the sintered thick film and to optimize the procedure of overall manufacturing. In this seminar, I will propose that adding low melting point ceramic powder in the mixed ceramic powder to optimize the process of copper thick film sintering, and how the evolution of the microstructure in the sintering process affects the electrical conductivity of the copper thick film, and finally show the conductivity and hardness of the copper thick film completed by sintering. |
Proceedings Inclusion? |
Planned: |
Keywords |
Ceramics, Copper / Nickel / Cobalt, Phase Transformations |