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Meeting 2022 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXI
Presentation Title Ab Initio Interfacial Stability and Cu-segregation Effect upon η’ and η2 Precipitates in Al-Zn-Mg-Cu Alloys
Author(s) Yu-ning Chiu, Chung-yi Yu, Shih-kang Lin
On-Site Speaker (Planned) Yu-ning Chiu
Abstract Scope The benefit of Cu on the η-family strengthening precipitates in Al-Zn-Mg-Cu alloy has been well studied over the past decades. However, the role of Cu in the structure evolution during the transition from metastable η’ to stable η2 has yet to be understood clearly. As a result, the structures and energetics of η’ and η2 interface supercells in Al-Zn-Mg-Cu alloy were thoroughly investigated through ab initio calculations. The most feasible interface supercells with solute segregated in η’ and η2 were constructed, and with which, a comprehensive discussion on interfacial energy and strain energy as well as the atomic local strain hydrostatic invariant (ALSHI) were provided to plot the energy landscape for the transition with and without the consideration of Cu-segregation effect. Finally, an unreported mechanism of Cu-segregation was revealed, and based on which, a new strategy for the future optimal design of Al-Zn-Mg-Cu alloys was proposed.
Proceedings Inclusion? Planned:
Keywords Aluminum, Phase Transformations, Computational Materials Science & Engineering

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

A Critical Analysis of Joining Processes for NiTi Shape Memory Alloys
Ab Initio Interfacial Stability and Cu-segregation Effect upon η’ and η2 Precipitates in Al-Zn-Mg-Cu Alloys
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Comparison of NiCo and NiP Electroplating for Wear Resistant Probe Tip
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Effect of Vertical Interfaces on Phase Transformation Behavior of MoS2
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Failure Analysis and Prediction of Solder Microbumps due to Side Wetting and Electromigration by 3D X-ray
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Interfacial Reaction between In Coated Cu Sheet and ENIG Substrate
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Interfacial Reactions between Sn-0.7 Cu Alloys C194, Alloy25, and C1990 Substrates
Interfacial Reactions in the Sn/C194 and Sn-3.0Ag-0.5Cu/C194 Couples
Investigation of Thermal Properties and Thermal Reliability of Ga-based Low Melting Temperature Alloys as Thermal Interface Materials (TIMs)
Linked Metamaterials with Adaptable Stiffness
Mechanical Performance of Advanced Multicomponent Solder Alloy under Thermal Aging
Mesoscale Simulations Guiding Data-driven Design of Electronic Materials
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Phase Transformation Temperatures of Sn-based Solder Alloys
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Room-temperature Electrochemical Healing of Difficult-to-weld Metallic Materials
Self-healing Kirkendall Voids at the Joint Interface between Sn and <111> Oriented and Nano-twinned Cu
Self-healing of Fiber-composite Laminates via In Situ Thermal Remending
Solution-processed Perovskite Photoabsorbers with Mixed Cations for Improved Stability in Solar Cells
Study of Ferroelectricity and Phase Transitions in Hafnia
The Challenge of Machine Learning the Stability of Materials
Using Solid-liquid Phase Transformation in Fusible Metals as a Self-healing Mechanism for Next Generation Metal-ion Battery Anodes
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