About this Abstract |
Meeting |
2022 TMS Annual Meeting & Exhibition
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Symposium
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Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXI
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Presentation Title |
Self-healing Kirkendall Voids at the Joint Interface between Sn and <111> Oriented and Nano-twinned Cu |
Author(s) |
Shiqi Zhou, Yubo Zhang, Yue Gao, Li-Yin Gao, Zhi-Quan Liu |
On-Site Speaker (Planned) |
Shiqi Zhou |
Abstract Scope |
<111> oriented and nano-twinned Cu ((111)nt-Cu) has excellent mechanical strength, good ductility, and conductivity. Therefore, (111)nt-Cu is expected to be utilized as an under-bump-metallization (UBM), Cu pillar, and redistribution layer. By now, several studies on solder joints using (111)nt-Cu have been published. However, the understanding of this novel material is still lacking. In this study, the intermetallic compound (IMC) layer and kirkendall voids were investigated at both Sn/(111)nt-Cu and Sn/traditional-Cu interfaces under thermal aging conditions. Current results show severe kirkendall voids formed on the Cu3Sn/(111)nt-Cu interface after a short aging time. Then, around 93% of voids healed-up after aging time tripled. In addition, Cu3Sn layer thickness decreased gradually on Sn/(111)nt-Cu interface. By contrast, no kirkendall void was found at the Sn/traditional-Cu interface after these aging stages. Now, a prolonged aging test is conducted, and the final results can contribute to the understanding of joint reliability using (111)nt-Cu as the UBM. |
Proceedings Inclusion? |
Planned: |
Keywords |
Joining, Phase Transformations, Thin Films and Interfaces |