About this Abstract |
Meeting |
2022 TMS Annual Meeting & Exhibition
|
Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXI
|
Presentation Title |
Interfacial Reaction between Sn-rich Solder and FeCoNiCu High-entropy Alloy |
Author(s) |
Yu-An Shen, Sheng-Wen Chen, Hao-Zhe Chen |
On-Site Speaker (Planned) |
Yu-An Shen |
Abstract Scope |
Sn-rich solders are commonly used for electrical interconnections in flip-chip and microbump solder joints for advanced electronic packaging. In the solder joints, the rapid growth of intermetallic compound (IMC) at the interfaces is a reliability issue during thermal aging and electromigration. To solve the issue, some studies focused on the interfacial reactions between the Sn-rich solders and metal pads with low diffusivities (Fe, Co, and Ni) in Sn. But the suppression of the interlayer growth is limited. On the other hand, the multi-elemental IMC formed at the interface between Sn-rich solders and high-entropy alloy possesses excellent thermal stability. However, the interfacial reaction between Sn-rich solder and FeCoNiCu high-entropy alloy(FCNC) is seldom studied. In this study, we will illustrate the wettability of Sn-rich solders on the FCNC substrate, and the crystal structure, elemental composition, and thermal stability of their interlayer. |
Proceedings Inclusion? |
Planned: |
Keywords |
Joining, Electronic Materials, High-Entropy Alloys |