|About this Abstract
||2022 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXI
||Interfacial Reaction between Sn-rich Solder and FeCoNiCu High-entropy Alloy
||Yu-An Shen, Sheng-Wen Chen, Hao-Zhe Chen
|On-Site Speaker (Planned)
Sn-rich solders are commonly used for electrical interconnections in flip-chip and microbump solder joints for advanced electronic packaging. In the solder joints, the rapid growth of intermetallic compound (IMC) at the interfaces is a reliability issue during thermal aging and electromigration. To solve the issue, some studies focused on the interfacial reactions between the Sn-rich solders and metal pads with low diffusivities (Fe, Co, and Ni) in Sn. But the suppression of the interlayer growth is limited. On the other hand, the multi-elemental IMC formed at the interface between Sn-rich solders and high-entropy alloy possesses excellent thermal stability. However, the interfacial reaction between Sn-rich solder and FeCoNiCu high-entropy alloy(FCNC) is seldom studied. In this study, we will illustrate the wettability of Sn-rich solders on the FCNC substrate, and the crystal structure, elemental composition, and thermal stability of their interlayer.
||Joining, Electronic Materials, High-Entropy Alloys