About this Abstract |
Meeting |
2022 TMS Annual Meeting & Exhibition
|
Symposium
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Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXI
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Presentation Title |
Failure Analysis and Prediction of Solder Microbumps due to Side Wetting and Electromigration by 3D X-ray |
Author(s) |
Po-Ning Hsu, Chih Chen, Kai-Cheng Hsieh, Tzu-Wen Lin, Cheng-Che Wu, Nien-Ti Tsou, Yu-Chieh Lo, Nan-Yo Chen, Mia Wu, Yong-Fen Hsieh, K. N. Tu |
On-Site Speaker (Planned) |
Chih Chen |
Abstract Scope |
The solder volume in a microbump continues to scale down. During reflow process or electromigration (EM) tests, solders may diffuse to the side walls of the under-bump-metallurgy (UBM) to form intermetallics, resulting in necking or voiding in the solder microbumps. In this presentation, non-destructive observation method through 3D X-ray was adopted to study voids formation and necking during reflow and EM. A daisy-chain test vehicle with the number of 400 solder microbumps was reflowed at 260 ℃ or under EM tests at 150 ℃. The structure of solder microbumps was Cu/Sn2.3Ag/Ni/Cu. With the non-destructive observation method, the evolution of EM failures can be analyzed when the resistance change was 0 %, 5 %, 10 %, and 20 %. Therefore, the process of void formation can be observed through different view angles of computed tomography (CT). Artificial intelligent deep learning was to employed to predict the reliability of the solder joints. |
Proceedings Inclusion? |
Planned: |
Keywords |
Joining, Machine Learning, Characterization |