| About this Abstract |
| Meeting |
2022 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXI
|
| Presentation Title |
Interfacial Reactions between Sn-0.7 Cu Alloys C194, Alloy25, and C1990 Substrates |
| Author(s) |
Yong-Chi Chang, Tzu-Yang Tsai, Tai-Hsuan Chung, Yee-Wen Yen |
| On-Site Speaker (Planned) |
Yong-Chi Chang |
| Abstract Scope |
The liquid/solid interfacial reactions in the Sn-0.7 wt.% Cu (SC)/C194 (Cu-2.2 wt.%Fe), SC/Alloy 25 (Cu-2 wt.%Be), and SC/C1990 (Cu-3.3wt.%Ti) couples at 240, 255 and 270°C for 0.5 to 10 h were investigated in this study. The (Cu, Fe)6Sn5 with micro-island shape and a thin layer of (Cu, Fe)3Sn phase were formed in the SC/C194 couple. In SC/Alloy 25 couples, the (Cu, Be)6Sn5 and (Cu, Be)3Sn phases were formed at the interface. As the reaction time was increased, the (Cu, Be)6Sn5 phase was repined to form the large grain and mass spalling of the (Cu, Be)6Sn5 phase was observed. Only the (Cu, Ti)6Sn5 phase was observed at the SC/C1990 interface. Total spread distance of the intermetallic compounds in three couples were increased as the increase of the reaction temperature and times. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Other, Other, Other |