|About this Abstract
||2022 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXI
||Mechanical Performance of Advanced Multicomponent Solder Alloy under Thermal Aging
||Ding Zhou, A.S.M.A. Haseeb, Andri Andriyana
|On-Site Speaker (Planned)
Reliability of lead free solders, used in harsh conditions such as in automotive, is still a serious concern. Simultaneous additions of multiple alloying elements like Bi, Sb, Ni etc. to conventional Sn-Ag-Cu (SAC) based solders have recently been investigated as a way to improve their reliability. The additional elements can bring about the improvements through solid solution and precipitation strengthening. In this study, the effects of simultaneous additions of Bi, Sb and Ni to SAC 305 solder on the evolution of microstructure and mechanical properties during thermal aging at 125 C for up to 1008 hours are investigated. Superior microstructural stability and improved mechanical strength of the multicomponent alloy at long aging time and its fracture behaviour are discussed.