| About this Abstract |
| Meeting |
2022 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXI
|
| Presentation Title |
Bi Orientation-dependence and Mechanical Properties in a Sn-Bi-Ag Low-temperature Lead-free Solder |
| Author(s) |
Chih-Han Yang, Yu-chen Liu, Yuki Hirata, Hiroshi Nishikawa, Shih-kang Lin |
| On-Site Speaker (Planned) |
Chih-Han Yang |
| Abstract Scope |
We designed low-temperature tin-bismuth-silver (Sn-Bi-Ag, SBA) solder by CALculation of PHAse Diagram (CALPHAD)-type thermodynamic calculations and performed corresponding key experiments. The goal is to suppress (Bi)-rich phase width growth, while keeping their low melting temperatures. This study shows that CALPHAD calculations make a good agreement with experimental results. In addition, we found Ag and Sn has some solubility in (Bi) phase. We furtherly used nanoindentation to investigate the orientation-dependence elastic modulus and hardness of (Bi) with different doping level. The elastic constant makes a good agreement with ab initio calculations. They show elastic and hardness anisotropy of (Bi) were alleviated by Ag and Sn addition. As for the tensile properties of the SBA solder in as-cast, high yield strength (YS), high ultimate tensile strength (UTS), and slightly better elongation than the conventional Sn-58Bi solder were obtained. After being thermally aged, higher strength and same elongation level of Sn-58Bi were observed. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Solidification, Modeling and Simulation, |