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Meeting 2022 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXI
Presentation Title Electronic Material Properties Exploration Using Machine Learning: In Effective Charge, Hardness, and Dissipation Factor
Author(s) Yu-chen Liu, Shih-kang Lin
On-Site Speaker (Planned) Yu-chen Liu
Abstract Scope Machine learning (ML) methods have been aggressively pursued as a powerful tool to decipher and predict the complex physical properties of materials. In this talk, we will show how we employed the ML method to develop models for exploring properties of electronic materials. These properties included the effective charge in electromigration effect, the hardness of Sn-based solders, and dissipation factor of the low-temperature cofired ceramics. We used these models to design potential candidates for real applications. For instance, we designed solders with hardness as high as 40.7 and as low as 5.5 Hv and characterized their properties. The microstructure was complicated, but our ML model was able to capture the hardness of given alloys after only being informed by the composition. In general, ML is potentially a powerful tool for exploring material properties in complex systems by using solely the composition and the process information.
Proceedings Inclusion? Planned:
Keywords Electronic Materials, Machine Learning, Computational Materials Science & Engineering

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

A Critical Analysis of Joining Processes for NiTi Shape Memory Alloys
Ab Initio Interfacial Stability and Cu-segregation Effect upon η’ and η2 Precipitates in Al-Zn-Mg-Cu Alloys
Bi Orientation-dependence and Mechanical Properties in a Sn-Bi-Ag Low-temperature Lead-free Solder
Comparison of NiCo and NiP Electroplating for Wear Resistant Probe Tip
Cu Sintering Process Modified by Adding a Low Temperature Liquid Sintering Step
Data-driven Rational Design of Conductive Copper-based Alloys with High Performance
Design of Multifunctional Architected Materials
Effect of Vertical Interfaces on Phase Transformation Behavior of MoS2
Electric Current-assisted Treatment for 7075 Aluminum Alloy to Withstand High-speed Impact
Electronic Material Properties Exploration Using Machine Learning: In Effective Charge, Hardness, and Dissipation Factor
Failure Analysis and Prediction of Solder Microbumps due to Side Wetting and Electromigration by 3D X-ray
Filp-chip Encapsulation with Hybrid Organic-inorganic Passivation of Perovskite Solar Cells
Interfacial Reaction between In Coated Cu Sheet and ENIG Substrate
Interfacial Reaction between Sn-rich Solder and FeCoNiCu High-entropy Alloy
Interfacial Reactions between Sn-0.7 Cu Alloys C194, Alloy25, and C1990 Substrates
Interfacial Reactions in the Sn/C194 and Sn-3.0Ag-0.5Cu/C194 Couples
Investigation of Thermal Properties and Thermal Reliability of Ga-based Low Melting Temperature Alloys as Thermal Interface Materials (TIMs)
Linked Metamaterials with Adaptable Stiffness
Mechanical Performance of Advanced Multicomponent Solder Alloy under Thermal Aging
Mesoscale Simulations Guiding Data-driven Design of Electronic Materials
Morphological Effect of Patterned Sapphire Substrate on Efficiency of White-light Phosphor LED Package
Novel Zr-based Alloy with Low Young's Modulus and Magnetic Susceptibility for Biomedical Implants
NOW ON-DEMAND ONLY - The Influence of Morphology in Ultrathin Ag Structure on ZnO/Ag/ZnO Transmittance Grown by Sputtering Compared with Simulation
Phase Transformation Temperatures of Sn-based Solder Alloys
Role of Composition in the Phase Transition of Ge-Sb-Te Alloys
Room-temperature Electrochemical Healing of Difficult-to-weld Metallic Materials
Self-healing Kirkendall Voids at the Joint Interface between Sn and <111> Oriented and Nano-twinned Cu
Self-healing of Fiber-composite Laminates via In Situ Thermal Remending
Solution-processed Perovskite Photoabsorbers with Mixed Cations for Improved Stability in Solar Cells
Study of Ferroelectricity and Phase Transitions in Hafnia
The Challenge of Machine Learning the Stability of Materials
Using Solid-liquid Phase Transformation in Fusible Metals as a Self-healing Mechanism for Next Generation Metal-ion Battery Anodes
Vat Polymerization of Adaptable and Reconfigurable Three-dimensional (3D) Micro-architected Materials

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