| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIX
|
| Presentation Title |
Interfacial Stability between High-temperature Lead-free Solders and Substrates |
| Author(s) |
Shih-kang Lin, Chih-han Yang, Ming-yueh Tsai, Bo-hsun Hsu |
| On-Site Speaker (Planned) |
Shih-kang Lin |
| Abstract Scope |
High-temperature interconnection materials have been widely used in for high-power electronics. Conventionally, high lead (Pb) is popularly used in consumer electronic products but harmful to the environment and human health. The high-temperature Pb-free solders search became a significant issue. Gold (Au)-based alloy is a suitable material because of its suitable melting point and excellent thermal and electronic conductivities. However, Au is very expensive and only can be applied in niche applications. In this study, we will present interfacial stability of the Au-based high-temperature lead-free solders. Also, high throughput calculations were conducted using the PANDAT software in console mode to search for the new ternary or higher order systems. In a few millions of point calculations, we will purpose other high-temperature interconnection materials that are more economically scalable for consumer electronics. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |