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Meeting 2020 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIX
Presentation Title Interfacial Reaction in the Lead-free Solder/Cu-2.0Be (Alloy 25) Couples
Author(s) Yu-Chun Li, Ching-Hsun Chang, Hsien-Ming Hsiao, Satoshi Ikubo, Yee-Wen Yen
On-Site Speaker (Planned) Yu-Chun Li
Abstract Scope Interfacial reactions between lead-free solders, such as Sn, Sn-3.0Ag-0.5Cu and Sn-9Zn alloys and Cu-2.0% wt. Be (Alloy 25) by using liquid/solid couple technique were investigated. The result shows only the scallop-shaped (Cu, Be)6Sn5 phase was formed in the Sn/Alloy 25 couple reacted at 240C for 0.5-2 h. When reaction times were increased to 4 h or reaction temperature at 255 to 270 C, the (Cu, Be)3Sn phase was observed at interface. In Sn-3.0Ag-0.5Cu/Alloy 25 couple, the results are similar to those in the Sn/Alloy 25 couples. Only the scallop-shaped (Cu, Be, Ag)6Sn5 phase is formed at the interface. As the reaction time and temperature were increased, both the (Cu, Be, Ag)6Sn5 and (Cu, Be, Ag)3Sn phase were formed. The (Cu, Sn)Zn5 and (Cu, Sn)5Zn8 phases were observed in the Sn-9Zn/Alloy 25 couple. The thickness of intermetallic compounds in couples obeyed parabolic law and the IMC growth mechanism is diffusion control.
Proceedings Inclusion? Planned: Supplemental Proceedings volume

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D-11: CALPHAD-assisted Analyses of BOF Slag Recovery
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D-13: Effects of Current Stressing on Mechanical Property and Microstructure of an Fe-Ni Alloy at Ambient Temperature
D-14: Effects of Plating Current Density on the Microstructure of Cu Pillars and Its Solderability
D-15: Effects of Surface Finish on the Interfacial Cu6Sn5 Morphology and Mechanical Characteristics in Solder Joints
D-16: From Electric Current-induced Lattice Strain to Electromigration Occurrence: An In-situ Study
D-17: Interfacial Reaction of Au-xAg/Al Couples
D-18: Interfacial Reactions in the Au/Sn-xZn/Cu Sandwich Couples
D-19: Interfacial Reactions in the Cu/Sn/Ni Sandwich Couples
D-20: Interfacial Reactions in the Sn/Au-xCu Couples
D-21: Interfacial Reactions of Ag-Au-xPd Alloys Wire Bonding with Al
D-22: Mechanisms of Abnormal Grain Growth of Al Bonding Wires under Annealing Process
Effects of Copper Electroplating Parameters on the Copper-based Solder Joint Reactions
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