| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIX
|
| Presentation Title |
The Effect of the Cu Preferred Orientation on the Adhesion between Cu and LCP in FCCL |
| Author(s) |
Chiahung Lee, Cheng-Yi Liu |
| On-Site Speaker (Planned) |
Chiahung Lee |
| Abstract Scope |
In high speed and high frequency generation, traditional polyimide (PI) was not match the need for the fifth generation mobile networks (5G) in flexible copper clad laminate (FCCL). Liquid crystal polymer (LCP) has many advantages to substitute the PI because of its low dielectric constant and low loss tangent. However, the adhesion between Cu and LCP was lower than that between Cu and PI. How to increase the adhesion between Cu and LCP was a big challenge for the 5G. In this study, the electroplating was used to create Cu(111), Cu(200), and Cu(220) preferred orientation on Cu foil. Then, different Cu preferred orientation was used to bond with LCP. We found that Cu(200) preferred orientation had better adhesion with LCP because of the high surface activity of Cu(200). The effect of the Cu preferred orientation on the adhesion between Cu and LCP will be discussed in this study. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |