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Meeting 2020 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIX
Presentation Title The Effect of the Cu Preferred Orientation on the Adhesion between Cu and LCP in FCCL
Author(s) Chiahung Lee, Cheng-Yi Liu
On-Site Speaker (Planned) Chiahung Lee
Abstract Scope In high speed and high frequency generation, traditional polyimide (PI) was not match the need for the fifth generation mobile networks (5G) in flexible copper clad laminate (FCCL). Liquid crystal polymer (LCP) has many advantages to substitute the PI because of its low dielectric constant and low loss tangent. However, the adhesion between Cu and LCP was lower than that between Cu and PI. How to increase the adhesion between Cu and LCP was a big challenge for the 5G. In this study, the electroplating was used to create Cu(111), Cu(200), and Cu(220) preferred orientation on Cu foil. Then, different Cu preferred orientation was used to bond with LCP. We found that Cu(200) preferred orientation had better adhesion with LCP because of the high surface activity of Cu(200). The effect of the Cu preferred orientation on the adhesion between Cu and LCP will be discussed in this study.
Proceedings Inclusion? Planned: Supplemental Proceedings volume


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An Ab-initio Study on the Structural and Electrochemical Propeties of Na3V2(PO4)2F3 as Cathode Materials for Hybrid-ion Batteries
CALPHAD-assisted Analyses of BOF Slag Modification and Reduction
Challenges and Solutions for Experimental Investigation of Air and Moisture Sensitive Li Alloys
D-10: A Switching Model of Phase-change Memory by Combining Electrothermal and Phase-field Models
D-11: CALPHAD-assisted Analyses of BOF Slag Recovery
D-12: Comparison of Oxide Reduction Temperature between Highly <111>-Oriented Nanotwinned Cu and Regular Cu Films
D-13: Effects of Current Stressing on Mechanical Property and Microstructure of an Fe-Ni Alloy at Ambient Temperature
D-14: Effects of Plating Current Density on the Microstructure of Cu Pillars and Its Solderability
D-15: Effects of Surface Finish on the Interfacial Cu6Sn5 Morphology and Mechanical Characteristics in Solder Joints
D-16: From Electric Current-induced Lattice Strain to Electromigration Occurrence: An In-situ Study
D-17: Interfacial Reaction of Au-xAg/Al Couples
D-18: Interfacial Reactions in the Au/Sn-xZn/Cu Sandwich Couples
D-19: Interfacial Reactions in the Cu/Sn/Ni Sandwich Couples
D-20: Interfacial Reactions in the Sn/Au-xCu Couples
D-21: Interfacial Reactions of Ag-Au-xPd Alloys Wire Bonding with Al
D-22: Mechanisms of Abnormal Grain Growth of Al Bonding Wires under Annealing Process
Effects of Copper Electroplating Parameters on the Copper-based Solder Joint Reactions
Effects of Pd(P) Thickness on the Interfacial Reaction and Mechanical Properties of the Sn-3.5Ag/Au/Pd(P)/Ni(P) Microelectronic Joints
Electromigration Effect Upon Single-phase and Two-phase Ag-Cu Alloy: an In-situ Study
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High-throughput CALPHAD-type Calculation in Design of Coherent Precipitate-strengthening AlCuFeNiTi Multi-principal Element Alloys
In-situ Study of Electrochemical Migration of Tin in Presence of Contaminants
Interfacial Reaction in the Lead-free Solder/Cu-2.0Be (Alloy 25) Couples
Interfacial Reactions between Lead-free Solders and Electroless Co(B) Metallization
Interfacial Stability between High-temperature Lead-free Solders and Substrates
Investigation of Metal Filament Formation
Learning from the Ni3Sn2 for Cu6Sn5
Microstructure of Cu/Cu Joints using Sn-Coated Cu Particle Paste for High-temperature Application
Real-time Observation of the Accelerated Growth of (Cu,Ni)6Sn5 on Cu-xNi Current Collectors
Revisit the Blech Critical Product: Lattice Strain Induces Electromigration Effect
Study on Eelectromigration of Cu-Sn IMC Formation Due to Currents Stress and Temperature
Study on the Phase Diagrams of Bi-Te Binary and Bi-Te-RE (Yb, La, Ce, Nd, Sm, Tb, Er) Ternary Systems
The Effect of the Cu Preferred Orientation on the Adhesion between Cu and LCP in FCCL
Thermodynamic Modeling of the Cu-Mg-Si-Sn Quaternary System and Interpretation of Mg2(Si0.3Sn0.7)/Cu Thermoelectric Interconnections
Wafer Level SLID Bonding - Formation and Evolution of Microstructures
Zn Whisker Growth under High Temperature and Humidity Conditions

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