| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIX
|
| Presentation Title |
D-21: Interfacial Reactions of Ag-Au-xPd Alloys Wire Bonding with Al |
| Author(s) |
Chiao-Yi Yang, Kuo-Jung Chen, Wallace Chuang, Eckart Schellkes, Yee-Wen Yen |
| On-Site Speaker (Planned) |
Chiao-Yi Yang |
| Abstract Scope |
Recently, the wire bonding technology is the most widely used to connect chip and pad in the electronic packaging. Au-Ag alloys have good thermal and electrical conductivity and great ductility. They are suitable to replace the pure Au wire for the cost reduction. The interfacial reactions of several Au-Ag wires reacted with the Al pad at 150°C for various time, decapsulation and corrosion test were investigated in this study. The Au4Al phase was formed at the Au/Al interface. The Ag2Al phase was formed at Ag (coated Au)/Al, Ag (coated Pd)/Al, Au-95 wt.%Ag/Al and Ag/Al interface for 2000-h aging. When the aging time was increased to 3000 h, the Ag3Al phase was formed. For decapsulation, 95 vol.% HNO3 solution was a good solution to dissolve the mold compound. The result showed that the corrosion resistance order was Au > Ag (coated Au) > Ag (coated Pd) > Au-95 wt.%Ag. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |