| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIX
|
| Presentation Title |
Zn Whisker Growth under High Temperature and Humidity Conditions |
| Author(s) |
Eul Yong Chae, Keun Soo Kim |
| On-Site Speaker (Planned) |
Eul Yong Chae |
| Abstract Scope |
There has been an automotive interest on whisker growth because of the miniaturization of electronic components. Whiskers are generated from metallic surfaces such as electroplated Zn coating on steel plate which are widely used as anticorrosive protection. Recently, there are many field claims caused by a short circuit between terminals and Zn whiskers generated from automotive electronic components. Therefore, understanding of whisker growth is very important due to long-term reliability of electronic components. This study examined the Zn whisker growth of the electroplated Zn coating or the hot dip Zn plating on steel plate under thermal aging and high humidity conditions. Zn whiskers formed on the surface of the electroplated Zn coating after 72 hours over 100°C aging, and after 200 hours at 85°C/85%R.H. condition. Comparing with the electroplated Zn coating, the hot dip Zn plating was much stable against Zn whisker formation of all test conditions. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |