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Meeting 2020 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIX
Presentation Title Zn Whisker Growth under High Temperature and Humidity Conditions
Author(s) Eul Yong Chae, Keun Soo Kim
On-Site Speaker (Planned) Eul Yong Chae
Abstract Scope There has been an automotive interest on whisker growth because of the miniaturization of electronic components. Whiskers are generated from metallic surfaces such as electroplated Zn coating on steel plate which are widely used as anticorrosive protection. Recently, there are many field claims caused by a short circuit between terminals and Zn whiskers generated from automotive electronic components. Therefore, understanding of whisker growth is very important due to long-term reliability of electronic components. This study examined the Zn whisker growth of the electroplated Zn coating or the hot dip Zn plating on steel plate under thermal aging and high humidity conditions. Zn whiskers formed on the surface of the electroplated Zn coating after 72 hours over 100C aging, and after 200 hours at 85C/85%R.H. condition. Comparing with the electroplated Zn coating, the hot dip Zn plating was much stable against Zn whisker formation of all test conditions.
Proceedings Inclusion? Planned: Supplemental Proceedings volume

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

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CALPHAD-assisted Analyses of BOF Slag Modification and Reduction
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D-10: A Switching Model of Phase-change Memory by Combining Electrothermal and Phase-field Models
D-11: CALPHAD-assisted Analyses of BOF Slag Recovery
D-12: Comparison of Oxide Reduction Temperature between Highly <111>-Oriented Nanotwinned Cu and Regular Cu Films
D-13: Effects of Current Stressing on Mechanical Property and Microstructure of an Fe-Ni Alloy at Ambient Temperature
D-14: Effects of Plating Current Density on the Microstructure of Cu Pillars and Its Solderability
D-15: Effects of Surface Finish on the Interfacial Cu6Sn5 Morphology and Mechanical Characteristics in Solder Joints
D-16: From Electric Current-induced Lattice Strain to Electromigration Occurrence: An In-situ Study
D-17: Interfacial Reaction of Au-xAg/Al Couples
D-18: Interfacial Reactions in the Au/Sn-xZn/Cu Sandwich Couples
D-19: Interfacial Reactions in the Cu/Sn/Ni Sandwich Couples
D-20: Interfacial Reactions in the Sn/Au-xCu Couples
D-21: Interfacial Reactions of Ag-Au-xPd Alloys Wire Bonding with Al
D-22: Mechanisms of Abnormal Grain Growth of Al Bonding Wires under Annealing Process
Effects of Copper Electroplating Parameters on the Copper-based Solder Joint Reactions
Effects of Pd(P) Thickness on the Interfacial Reaction and Mechanical Properties of the Sn-3.5Ag/Au/Pd(P)/Ni(P) Microelectronic Joints
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