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Meeting 2020 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIX
Presentation Title 4D Characterization of Electromigration-induced Grain Boundary Damage of Cu Interconnects: X-ray Tomography Experiments and Phase-field Simulations
Author(s) William Farmer, Amey Luktuke, Marion Branch Kelly, Nikhilesh Chawla, Kumar Ankit
On-Site Speaker (Planned) Kumar Ankit
Abstract Scope Electromigration (EM) damage in polycrystalline interconnects, which causes major reliability concerns, typically nucleates at the surface and manifests as slits or hillocks. Although isolated experimental investigations and characterization of EM-defects using TEM have provided a rudimentary understanding, in-depth knowledge of failure mechanisms is warranted for efficient design and implementation of EM-inhibiting strategies. Here, we leverage our expertise in phase-field modeling, 3D X-ray imaging, and diffraction contrast tomography to achieve a fundamental understanding of the diffusional mechanisms accompanying grain boundary (GB) grooving and its subsequent degradation in copper interconnects. An in-depth parametric study sheds light on the dynamics of the intricate interplay between coarsening and GB slit propagation wherein multi-junctions are observed to be more susceptible to damage. Our 4D validation approach, which involves in situ visualization of microstructural degradation during accelerated EM-failure tests and a direct comparison with phase-field simulations, would enable accurate prediction of EM-induced failure in the future.
Proceedings Inclusion? Planned: Supplemental Proceedings volume


4D Characterization of Electromigration-induced Grain Boundary Damage of Cu Interconnects: X-ray Tomography Experiments and Phase-field Simulations
An Ab-initio Study on the Structural and Electrochemical Propeties of Na3V2(PO4)2F3 as Cathode Materials for Hybrid-ion Batteries
CALPHAD-assisted Analyses of BOF Slag Modification and Reduction
Challenges and Solutions for Experimental Investigation of Air and Moisture Sensitive Li Alloys
D-10: A Switching Model of Phase-change Memory by Combining Electrothermal and Phase-field Models
D-11: CALPHAD-assisted Analyses of BOF Slag Recovery
D-12: Comparison of Oxide Reduction Temperature between Highly <111>-Oriented Nanotwinned Cu and Regular Cu Films
D-13: Effects of Current Stressing on Mechanical Property and Microstructure of an Fe-Ni Alloy at Ambient Temperature
D-14: Effects of Plating Current Density on the Microstructure of Cu Pillars and Its Solderability
D-15: Effects of Surface Finish on the Interfacial Cu6Sn5 Morphology and Mechanical Characteristics in Solder Joints
D-16: From Electric Current-induced Lattice Strain to Electromigration Occurrence: An In-situ Study
D-17: Interfacial Reaction of Au-xAg/Al Couples
D-18: Interfacial Reactions in the Au/Sn-xZn/Cu Sandwich Couples
D-19: Interfacial Reactions in the Cu/Sn/Ni Sandwich Couples
D-20: Interfacial Reactions in the Sn/Au-xCu Couples
D-21: Interfacial Reactions of Ag-Au-xPd Alloys Wire Bonding with Al
D-22: Mechanisms of Abnormal Grain Growth of Al Bonding Wires under Annealing Process
Effects of Copper Electroplating Parameters on the Copper-based Solder Joint Reactions
Effects of Pd(P) Thickness on the Interfacial Reaction and Mechanical Properties of the Sn-3.5Ag/Au/Pd(P)/Ni(P) Microelectronic Joints
Electromigration Effect Upon Single-phase and Two-phase Ag-Cu Alloy: an In-situ Study
Electroplating of Rhodium using Pulse Current Plating Method
Full Battery Design for Li-ion Batteries Using CALPHAD Technique
High-throughput CALPHAD-type Calculation in Design of Coherent Precipitate-strengthening AlCuFeNiTi Multi-principal Element Alloys
In-situ Study of Electrochemical Migration of Tin in Presence of Contaminants
Interfacial Reaction in the Lead-free Solder/Cu-2.0Be (Alloy 25) Couples
Interfacial Reactions between Lead-free Solders and Electroless Co(B) Metallization
Interfacial Stability between High-temperature Lead-free Solders and Substrates
Investigation of Metal Filament Formation
Learning from the Ni3Sn2 for Cu6Sn5
Microstructure of Cu/Cu Joints using Sn-Coated Cu Particle Paste for High-temperature Application
Real-time Observation of the Accelerated Growth of (Cu,Ni)6Sn5 on Cu-xNi Current Collectors
Revisit the Blech Critical Product: Lattice Strain Induces Electromigration Effect
Study on Eelectromigration of Cu-Sn IMC Formation Due to Currents Stress and Temperature
Study on the Phase Diagrams of Bi-Te Binary and Bi-Te-RE (Yb, La, Ce, Nd, Sm, Tb, Er) Ternary Systems
The Effect of the Cu Preferred Orientation on the Adhesion between Cu and LCP in FCCL
Thermodynamic Modeling of the Cu-Mg-Si-Sn Quaternary System and Interpretation of Mg2(Si0.3Sn0.7)/Cu Thermoelectric Interconnections
Wafer Level SLID Bonding - Formation and Evolution of Microstructures
Zn Whisker Growth under High Temperature and Humidity Conditions

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