ProgramMaster Logo
Conference Tools for 2020 TMS Annual Meeting & Exhibition
Login
Register as a New User
Help
Submit An Abstract
Propose A Symposium
Presenter/Author Tools
Organizer/Editor Tools
About this Abstract
Meeting 2020 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIX
Presentation Title D-17: Interfacial Reaction of Au-xAg/Al Couples
Author(s) Chiao-Yi Yang, Kuo-Jung Chen, Hsien-Ming Hsiao, Yee-Wen Yen
On-Site Speaker (Planned) Chiao-Yi Yang
Abstract Scope The Au/Al structure in the wire bonding technology is the most widely used and mature connection circuit in electronic assembly. In this study, various Au-xAg/Al couples were prepared and aged at 450C. The results indicated that the AuAl2, Au2Al, and Au4Al phases were formed at the Au-25 wt.%Ag/Al interface. When the Ag content in the Au was increased to 30, 40, 50 and 75 wt.%., the Ag2Al, AuAl2, and Au4Al phases were formed at the interface. The total intermetallic compounds (IMCs) thickness was increased when the Ag content was increased. Meanwhile, when the Ag content was increased, the IMCs formation at the interface was changed from the Au-Al system to the Au-Ag and Au-Al systems.
Proceedings Inclusion? Planned: Supplemental Proceedings volume

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

4D Characterization of Electromigration-induced Grain Boundary Damage of Cu Interconnects: X-ray Tomography Experiments and Phase-field Simulations
An Ab-initio Study on the Structural and Electrochemical Propeties of Na3V2(PO4)2F3 as Cathode Materials for Hybrid-ion Batteries
CALPHAD-assisted Analyses of BOF Slag Modification and Reduction
Challenges and Solutions for Experimental Investigation of Air and Moisture Sensitive Li Alloys
D-10: A Switching Model of Phase-change Memory by Combining Electrothermal and Phase-field Models
D-11: CALPHAD-assisted Analyses of BOF Slag Recovery
D-12: Comparison of Oxide Reduction Temperature between Highly <111>-Oriented Nanotwinned Cu and Regular Cu Films
D-13: Effects of Current Stressing on Mechanical Property and Microstructure of an Fe-Ni Alloy at Ambient Temperature
D-14: Effects of Plating Current Density on the Microstructure of Cu Pillars and Its Solderability
D-15: Effects of Surface Finish on the Interfacial Cu6Sn5 Morphology and Mechanical Characteristics in Solder Joints
D-16: From Electric Current-induced Lattice Strain to Electromigration Occurrence: An In-situ Study
D-17: Interfacial Reaction of Au-xAg/Al Couples
D-18: Interfacial Reactions in the Au/Sn-xZn/Cu Sandwich Couples
D-19: Interfacial Reactions in the Cu/Sn/Ni Sandwich Couples
D-20: Interfacial Reactions in the Sn/Au-xCu Couples
D-21: Interfacial Reactions of Ag-Au-xPd Alloys Wire Bonding with Al
D-22: Mechanisms of Abnormal Grain Growth of Al Bonding Wires under Annealing Process
Effects of Copper Electroplating Parameters on the Copper-based Solder Joint Reactions
Effects of Pd(P) Thickness on the Interfacial Reaction and Mechanical Properties of the Sn-3.5Ag/Au/Pd(P)/Ni(P) Microelectronic Joints
Electromigration Effect Upon Single-phase and Two-phase Ag-Cu Alloy: an In-situ Study
Electroplating of Rhodium using Pulse Current Plating Method
Full Battery Design for Li-ion Batteries Using CALPHAD Technique
High-throughput CALPHAD-type Calculation in Design of Coherent Precipitate-strengthening AlCuFeNiTi Multi-principal Element Alloys
In-situ Study of Electrochemical Migration of Tin in Presence of Contaminants
Interfacial Reaction in the Lead-free Solder/Cu-2.0Be (Alloy 25) Couples
Interfacial Reactions between Lead-free Solders and Electroless Co(B) Metallization
Interfacial Stability between High-temperature Lead-free Solders and Substrates
Investigation of Metal Filament Formation
Learning from the Ni3Sn2 for Cu6Sn5
Microstructure of Cu/Cu Joints using Sn-Coated Cu Particle Paste for High-temperature Application
Real-time Observation of the Accelerated Growth of (Cu,Ni)6Sn5 on Cu-xNi Current Collectors
Revisit the Blech Critical Product: Lattice Strain Induces Electromigration Effect
Study on Eelectromigration of Cu-Sn IMC Formation Due to Currents Stress and Temperature
Study on the Phase Diagrams of Bi-Te Binary and Bi-Te-RE (Yb, La, Ce, Nd, Sm, Tb, Er) Ternary Systems
The Effect of the Cu Preferred Orientation on the Adhesion between Cu and LCP in FCCL
Thermodynamic Modeling of the Cu-Mg-Si-Sn Quaternary System and Interpretation of Mg2(Si0.3Sn0.7)/Cu Thermoelectric Interconnections
Wafer Level SLID Bonding - Formation and Evolution of Microstructures
Zn Whisker Growth under High Temperature and Humidity Conditions

Questions about ProgramMaster? Contact programming@programmaster.org