| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIX
|
| Presentation Title |
D-14: Effects of Plating Current Density on the Microstructure of Cu Pillars and Its Solderability |
| Author(s) |
Pei-Tzu Lee, Ying-Syuan Wu, Cheng-Yu Lee, Wei-Ling Chou, Hung-Cheng Liu, Cheng-En Ho |
| On-Site Speaker (Planned) |
Pei-Tzu Lee |
| Abstract Scope |
In this study, effects of plating current density (j) on the Cu pillar microstructure and its solderability were investigated. Analyses of transmission electron microscopy (TEM) and electron backscatter diffraction (EBSD) showed that the Cu grain size and the crystallographic orientation strongly depended on j. Two intermetallic compound (IMC) species (η-Cu6Sn5 and Cu3Sn) accompanying with the material defects (e.g., nanovoids) formed at the solder/Cu pillar interface after reflow, particularly for the high j case (10 ASD). Upon high-speed ball shear testing, the shear force of Cu pillar bumps significantly decreased with increasing j due to the presence of numerous nanovoids at the interface. The information of the present study advances our understanding of the j effects on the electrochemical metal deposition, and will be helpful in development of the high-speed Cu electrodeposition and Cu pillar bump technologies. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |