| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIX
|
| Presentation Title |
Microstructure of Cu/Cu Joints using Sn-Coated Cu Particle Paste for High-temperature Application |
| Author(s) |
Hiroshi Nishikawa, Xiangdong Liu |
| On-Site Speaker (Planned) |
Hiroshi Nishikawa |
| Abstract Scope |
To assemble power modules for high-temperature application, the high temperature packaging technology such as a die attach process has been required. As a die attach process, we focus on a transient liquid phase (TLP) bonding, which can be operated at a low temperature while resulting in higher re-melting temperatures of bonded joints. However, some drawbacks of this technology still remain. For example, the duration of this process is too long, up to a few hours, and multiple hours of annealing are required to achieve a thermodynamically stable joint. In this time, we evaluate the microstructure of the joints using Sn-coated Cu particles and the bonding strength of the joints. A thermally stable joint fully comprising Cu3Sn phase with a dispersion of Cu particles could be obtained after sintering for 30 s at 300 ℃ under a formic acid atmosphere. The shear strength of the joint was about 25 MPa. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |