|About this Abstract
||7th World Congress on Integrated Computational Materials Engineering (ICME 2023)
||Directed Energy Deposition of Al-0.5Sc-0.5Si Alloy: Effect of Thermal Cycles in Microstructure and Mechanical Properties
||Amit Kumar Singh, Yasham Amar Mundada, Priyanshu Bajaj, Sushil Kumar Mishra, Amit Arora
|On-Site Speaker (Planned)
Interest in Additive Manufacturing has significantly increased in aerospace, automobile, and electronic industries. Complex features can be built with the specimen in single step. Similarly, post-processing such as machining and heat treatment can also be eliminated to obtain an engineered specimen with better mechanical properties. However, there are numerous challenges in studying the microstructure and mechanical properties of the deposited specimen due to the very complex heating and cooling cycle. Therefore, the heat transfer and material flow model is developed to compute the thermal cycle and correlate with the structure and mechanical properties of the specimen in the multi-layer deposition of Al-0.5Sc-0.5Si alloy. The thermal cycles, melt pool dimension, and cooling rates are computed around the vicinity of the melt pool for multi-layer deposition, and solidification morphologies are predicted using the CET solidification map. The solidification morphologies are further correlated with the microhardness in the multi-layer deposition of Al-0.5Sc-0.5Si alloy.