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About this Symposium
Meeting 2021 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XX
Sponsorship TMS Functional Materials Division
TMS Structural Materials Division
TMS: Alloy Phases Committee
Organizer(s) Hiroshi Nishikawa, Osaka University
Shih-Kang Lin, National Cheng Kung University
Chao-Hong Wang, National Chung Cheng University
Chih-Ming Chen, National Chung Hsing University
Jaeho Lee, Hongik University
Zhi-Quan Liu, Shenzhen Institutes of Advanced Technology, CAS
Ming-Tzer Lin, National Chung Hsing University
Dajian Li, Karlsruhe Institute of Technology
Yu Zhong, Worcester Polytechnic Institute
Yee-wen Yen, National Taiwan University of Science and Technology
A.S.Md Abdul Haseeb, University of Malaya
Ligang Zhang, Central South University
Sehoon Yoo, KITECH
Vesa Vuorinen, Aalto University
Yu-chen Liu, National Cheng Kung University
Scope This is the 20th in a series of TMS symposia addressing the stability, transformation, and formation of phases during the fabrication, processing, and utilization of electronic materials and devices. Topics of interests range from microelectronic technologies to advanced energy technologies, including phase stability, transformation, formation, and morphological evolution of electronic packaging materials, interconnection materials, integrated circuit materials, optoelectronic materials as well as energy storage and generating materials.
Abstracts Due 07/20/2020
Proceedings Plan Planned:
PRESENTATIONS APPROVED FOR THIS SYMPOSIUM INCLUDE

Change in electric resistance of conductive pastes including Ag particles coated with various higher fatty acids during curing process
Diffusivities and atomic mobilities in bcc Ti-Nb-Zr-Sn alloys
Effect of initial volume ratio and reflow temperature on the microstructure of SnBiAg-SAC mixed solder joints
Effect of low Bi content on mechanical property of Sn-Bi-Zn alloy before and after thermal aging
Effects of bromide and adipic acid on electrochemical migration of tin
Electric current effect on the high-strain-rate deformation of AA7075-T6 Al-alloy
Electroplating of NiP for the low residual and high strength MEMS probe tip
High-throughput calculations for Sn-Bi-Ag and Sn-Bi-Ag-In low-temperature lead-free solders
IMC-free low-temperature TLP Cu-to-Cu interconnection with excellent thermal stability
Interfacial microstructure evolution of Ag/ENIG and Ag/Cu joint under thermal aging
Interfacial reactions in the Bi2Te3 thermoelectric modules
Intermetallic Reactions and Interfacial Stability in Cu-Co-Sn System
Machine Learning for Perovskite Phase Stability
Microstructure and Mechanical Property of Transient Liquid Phase Bonding by Sn/Cu/Sn layer conditions for high-temperature die attachment
Properties and microstructure evolution of Sn/Cu joints bearing SiC nanowires and graphene nanosheets for 3D packaging
Review of X-ray Microbeam Study of Electromigration
Solid-Liquid Interdiffusion (SLID) bonding; for thermal challenges in microsystem bonding
Solid-Liquid Interfacial Reaction between Cu and In-48Sn Alloy
Study on the phase diagrams of Bi-Te-RE (Yb, La, Ce, Nd, Sm, Tb, Er) systems
Synchrotron White Laue Nanodiffraction Characterization of Allotropic Phase Transformation of Hexagonal- into Monoclinic-Cu6Sn5
Synthesis and Characterization of Silver Tin Alloy Powders by High Energy Ball Milling
The microstructure and properties variations of Sn-coated Cu wires induced by electromigration
The Significance of Transport Electronic Entropy in VO2
Thermomigration failure induced by surface diffusion of Sn on Ni/Cu metallization in microbumps for 2.5-dimensional Integrated Circuits Packaging
Towards predictive solid-state synthesis: understanding phase evolution during the formation of YBCO
Using machine learning to predict hardness of Sn-based alloys
Vertically Stacked 2H-1T Dual-Phase TMD Microstructures during Lithium Intercalation: A First Principles Study


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