| About this Abstract |
| Meeting |
2021 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XX
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| Presentation Title |
IMC-free Low-temperature TLP Cu-to-Cu Interconnection with Excellent Thermal Stability |
| Author(s) |
Shih-kang Lin, Yu-chen Liu, Chih-han Yang, Yu-Hsiang Hsieh, Chien-wei Huang, Chih-feng Lin |
| On-Site Speaker (Planned) |
Shih-kang Lin |
| Abstract Scope |
Cu-to-Cu bonding is an essential process for advanced electronic packaging. The phase formation at the bonding interface crucially determines the reliability of the joint. Herein, we propose an approach for fabricating face-centered cubic solid-solution joints without formation of intermetallic compound by using a trace amount of Ga and Ni under-bump-metallurgy for the reactive diffusion bonding at 300°C. The Cu/Ni/Ga/Ni/Cu sandwich couple fully transformed into the Cu/fcc-(Ni,Cu,Ga)/Cu joint after bonding. A shear-strength of 43.5 MPa was achieved in the as-bonded joint due to the formation of grains across the bonding interface, while it does not degrade after prolonged post-annealing at 300°C for 200 h. Instead, an even stronger joint with a shear-strength of 48.2 MPa was obtained. We demonstrated the fabrication of IMC-free, low temperature, thermally stable Cu-to-Cu joints using transient molten Ga and Ni UBM, and the technology is potential for a large area bonding. |
| Proceedings Inclusion? |
Planned: |