| About this Abstract |
| Meeting |
2021 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XX
|
| Presentation Title |
Interfacial Microstructure Evolution of Ag/ENIG and Ag/Cu Joint under Thermal Aging |
| Author(s) |
Minsu Kim, Sehoon Yoo, Hiroshi Nishikawa |
| On-Site Speaker (Planned) |
Minsu Kim |
| Abstract Scope |
Nowadays, the electric-powered vehicles have been received attention to reduce carbon emission and air pollution. A power module is a key component in electronic vehicle, for the conversion and distribution of electrical energy. Ag sintering has been received attention its high electrical/thermal conductivity and superior mechanical properties for power module die attach. We adopted Ag nanoporous preform for the die attach material. Here we investigated thermally activated degradation of Ag nanoporous bonding joint with bare Cu and ENIG finished Cu substrates at elevated temperature in air condition. Thermal storage test was performed at 250 oC up to 1000 h in air condition. The microstructure evolution at the Ag/Cu and Ag/ENIG interfaces by the diffusion and oxidation was examined using EPMA and TEM. |
| Proceedings Inclusion? |
Planned: |