| About this Abstract |
| Meeting |
2021 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XX
|
| Presentation Title |
Solid-liquid Interfacial Reaction between Cu and In-48Sn Alloy |
| Author(s) |
Fu-Ling Chang, C. Robert Kao, H. T. Hung, S. Y. Lin |
| On-Site Speaker (Planned) |
Fu-Ling Chang |
| Abstract Scope |
Soldering temperature below 200℃ is required to avoid the warpage of bonding chips for many applications. Low temperature alloys, such as In-48Sn and Sn-58Bi, are receiving the most attentions. Sn-58Bi alloy, with superior fatigue resistance and tensile strength, has been widely used in the industry. However, the brittle property of Bi-containing phases restricts its application. On the other hand, In-48Sn alloy, with good mechanical properties and excellent thermal conductivity, has not yet been fully investigated. Therefore, the present study focused on the interfacial reactions between Cu and molten In-48Sn solder alloy at 150℃. To overcome the difficulty of polishing In-containing samples and to obtain artifact-free microstructures, cryogenic broad Ar beam ion polishing was applied. Electron probe micro-analyzer and X-Ray diffractometer were also used to identify the phase structure at the interface. |
| Proceedings Inclusion? |
Planned: |