About this Abstract |
Meeting |
2021 TMS Annual Meeting & Exhibition
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Symposium
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Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XX
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Presentation Title |
Solid-Liquid Interdiffusion (SLID) Bonding; For Thermal Challenges in Microsystem Bonding |
Author(s) |
Knut Aasmundtveit, Hoang-Vu Nguyen |
On-Site Speaker (Planned) |
Knut Aasmundtveit |
Abstract Scope |
Solid-Liquid Interdiffusion (SLID) bonding for microelectronics and microsystems is based on a two- (or more) metal system, where a high-melting and a low-melting metal reacts to high-temperature stable intermetallics. By proper design of the initial metal layers, the final bond can then tolerate higher temperatures than the bonding temperature, and the final bondline may be in thermal equilibrium. SLID bonding is therefore an excellent choice for high-temperature applications, and can also provide fine-pitch bonding as well as very thin bondlines.The keynote will review the SLID work done at our university, which spans a number of SLID systems: Cu-Sn, where our focus was to optimize the process for industrial wafer-level bonding for vacuum encapsulation; Au-Sn, determining the intermetallic phases present and showing high reliability also when bonding dissimilar materials; Au-In-Bi, where very low bonding temperature gives temperature stability better than solder. Ni-Sn, Au-In and SLID related techniques will be covered. |
Proceedings Inclusion? |
Planned: |