About this Abstract |
Meeting |
2021 TMS Annual Meeting & Exhibition
|
Symposium
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Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XX
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Presentation Title |
Electroplating of NiP for the Low Residual and High Strength MEMS Probe Tip |
Author(s) |
Na-Young Kang, Jaeho Lee |
On-Site Speaker (Planned) |
Jaeho Lee |
Abstract Scope |
Probe card is one of reliability testing tool in semiconductor system. MEMS technology is used in MEMS probe tip fabrication. Since the reliability of probe is dependent on the physical property of probe tip, the hard and wear resistant material is used. Ni-P is one of the candidate material for this purpose. Ni-P probe tip is fabricated through electroplating method. The physical properties of Ni-P plating is dependent on the contents of P as well as plating property such as grain size and residual stress. In this study the effect of plating bath conditions on the Ni-P electroplating is investigated. The relationship between concentration of P and contents of coating is investigated. The effects of current density on Ni-P electroplating is also investigated. The surface hardness and crystallography of coating is measured and compared. The effects of additive on the properties and contents of the coating is finally optimized. |
Proceedings Inclusion? |
Planned: |