| About this Abstract |
| Meeting |
2021 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XX
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| Presentation Title |
The Microstructure and Properties Variations of Sn-coated Cu Wires Induced by Electromigration |
| Author(s) |
Liu Hsiao-Chun, Chien-Lung Liang, Tsung-Chieh Chiu, Kwang-Lung Lin |
| On-Site Speaker (Planned) |
Liu Hsiao-Chun |
| Abstract Scope |
Sn-coated Cu wire was designed as a fuse material in electronic products. A reliable fuse material should be able to sustain a long-term operating environment with electric current stressing before the fusing condition. In this study, Sn-coated Cu wires (145μm/121μm dimeter with/without Sn coating) were investigated for the microstructure and properties variations induced by electromigration. The wires were stressed with direct current at 9.7-14.6 × 103 A/cm2 (1.6-2.4A) for 4-36 h. Electromigration was found to induce significant drops in elongation and toughness, as great as 40% decrement, of the Sn-coated Cu wire. The ultimate tensile strength and electrical resistance properties did not vary prominently with less than 5% variations. The microstructure evolutions of the Cu wire matrix and the intermetallic compounds formed at the Cu/Sn interface under electromigration were investigated using dual-beam focused ion beam and electron backscatter diffraction techniques. The mechanisms involved in the microstructure-properties variations were also disclosed. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Mechanical Properties, Phase Transformations |