About this Abstract |
Meeting |
2021 TMS Annual Meeting & Exhibition
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Symposium
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Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XX
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Presentation Title |
Effect of Low Bi Content on Mechanical Property of Sn-Bi-Zn Alloy before and after Thermal Aging |
Author(s) |
Hiroshi Nishikawa, Shiqi Zhou, Chih-han Yang, Yu-An Shen, Shih-kang Lin |
On-Site Speaker (Planned) |
Hiroshi Nishikawa |
Abstract Scope |
Recently, eutectic Sn-58Bi alloy is becoming one of the candidates of the low-temperature lead-free solders. High joint strength, large creep resistance, and good wettability were recognized as advantages. However, the brittleness of eutectic Sn-58Bi alloy is one of the unsolved issues. To address the issue, Zn was selected as the element to control the liquidus temperature of the Sn-Bi-Zn ternary system. In this study, Sn-Bi-Zn alloy with low Bi content was examined by tensile tests before and after aging. A fine microstructure containing Sn-Bi-Zn ternary structure and higher volume fraction of Sn-rich phase were observed. Before aging, approximately 112 % elongation improvement for the Sn-Bi-Zn alloy was obtained compared to that of eutectic Sn-58Bi alloy. After aging, the elongation was still superior than that of eutectic Sn-58Bi alloy owing to the higher volume fraction of Sn-rich phase. |
Proceedings Inclusion? |
Planned: |