| About this Abstract |
| Meeting |
2021 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XX
|
| Presentation Title |
Effects of Bromide and Adipic Acid on Electrochemical Migration of Tin |
| Author(s) |
A.S.Md Abdul Haseeb, Ee Lynn Lee, Yi Sing Goh, Y. H. Wong, M. F. M. Sabri, B. Y. Low |
| On-Site Speaker (Planned) |
A.S.Md Abdul Haseeb |
| Abstract Scope |
Electrochemical migration (ECM) becomes a serious reliability issue as the pitch size in electronic packages decreases due to miniaturization. ECM is an electrochemical reaction that occurs in the presence of electrolyte and bias voltage. During ECM, metallic components dissolve at the anode and redeposit at the cathode in the form of dendrites leading eventually to short circuit failure. Contaminants originating from manufacturing process steps, flux residue and environment accelerate the process. This work investigates ECM process of tin in the presence of contaminants e.g., bromide and adipic acid. Water drop test (WDT) was conducted in the two-probe semiconductor characterization system under a high-power optical microscope for the in-situ investigation. The products of ECM such as dendrites and precipitates were characterized by SEM/ EDX and XPS. The effects of different contaminants on the mean time to failure and the mechanism of ECM are discussed. |
| Proceedings Inclusion? |
Planned: |