| About this Abstract |
| Meeting |
2021 TMS Annual Meeting & Exhibition
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| Symposium
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Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XX
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| Presentation Title |
Intermetallic Reactions and Interfacial Stability in Cu-Co-Sn System |
| Author(s) |
Fahimeh Emadi, Vesa Vuorinen, Hongqun Dong, Mervi Paulasto-Kröckel |
| On-Site Speaker (Planned) |
Fahimeh Emadi |
| Abstract Scope |
Wafer level Solid Liquid Interdiffusion (SLID) bonding is one of the most attractive novel methods for packaging of Micro (Opto) Electro Mechanical Systems (MEMS/MOEMS). Cobalt appears as a promising contact metallization for CuSn based SLID bonding metallurgy. When utilizing Co-Sn-Cu interconnections, several different intermetallic compounds (IMCs) like (Cu,Co)6Sn5, (Cu,Co)Sn, (Cu,Co)Sn3, and Cu3Sn are generated depending on the process parameters. Based on the IMC phase structure, the properties of the interconnections can vary significantly. For example, it was observed by C. Du et.al. that the weak (Cu,Co)Sn3/Co interface deteriorate the mechanical properties of the bond. In this work Cu-Sn electroplated Si chips were bonded to Co substrates. The interconnection microstructures and the changes in local equilibria were analysed as a function of bonding temperature and time. It was found out that the stability of the interconnection interfaces is drastically affected by the changes in local nominal composition of the bond. |
| Proceedings Inclusion? |
Planned: |