| About this Abstract |
| Meeting |
2021 TMS Annual Meeting & Exhibition
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| Symposium
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Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XX
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| Presentation Title |
High-throughput Calculations for Sn-Bi-Ag and Sn-Bi-Ag-In Low-temperature Lead-free Solders |
| Author(s) |
Chih-Han Yang, Yuki Hirata, Hiroshi Nishikawa, Shih-kang Lin |
| On-Site Speaker (Planned) |
Chih-Han Yang |
| Abstract Scope |
Low-temperature lead(Pb)-free solders with low cost and high reliability are in demand in the electronic industry. Eutectic Sn-58Bi with high mechanical properties and low melting temperature at 139 °C has drawn significant interest in the industry. However, the coarsened (Bi)-rich phase deteriorated the reliability of the solder joint. The goal is to supress (Bi)-rich phase grain growth, while keeping their low melting temperatures. In this study, CALPHAD-type thermodynamic high-throughput calculations (HTC) using the PANDAT software and corresponding key experiments were performed to design Sn-Bi-Ag (SBA) and Sn-Bi-Ag-In (SBAI) systems. Thousands of calculated solidification paths based on the Scheil model was employed. As for the mechanical properties of the SBA and SBAI solder, high yield strength, high ultimate tensile strength, and slightly better elongation were obtained. This study shows that CALPHAD calculations make a good agreement with experimental results in phase fraction, melting point, and paths of solidification. |
| Proceedings Inclusion? |
Planned: |