| Abstract Scope |
Bi2Te3 and Bi2Te3-based alloys are most important thermoelectric materials. The Ag-Sb eutectic alloy is a promising joining material for mid-temperature applications, and Ni and Cu are frequently encountered barrier layer and electrode materials. There are Cu/Ag-Sb, Ag-Sb/Ni, and Ni/Bi2Te3 interfaces in the modules, and their interfacial reactions are examined. The interfacial reactions in the Ag-41.0at%Sb/Cu couples at 300 and 500℃ are experimentally determined. The phase equilibria isothermal sections of Ag-Cu-Sb at 300 and 500℃ to provide fundamental material information and to illustrate the interfacial reaction in the Ag-Sb/Cu couples. Two reaction phases, Cu2Sb and Ag3Sb, are formed in the Ag-Sb/Cu couples reacted at 300℃. Three reaction phases, Cu2Sb, Cu3Sb and Ag3Sb, are formed in the Ag-Sb/Cu couples reacted at 500℃. The reaction rate at 500℃ is extremely fast. In the Ag-Sb/Ni couples, the reaction phases are NiSb and NiSb2 at 350℃ and are Ni3Sb, Ni5Sb3 and NiSb at 550℃. |