About this Abstract |
Meeting |
MS&T22: Materials Science & Technology
|
Symposium
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Advances in Emerging Electronic Nanomaterials: Synthesis, Enhanced Properties, Integration, and Applications
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Presentation Title |
Wafer-scale Heterogeneous Integration of Atomically Thin Electronic Materials on Arbitrary Substrates toward Mechanically Reconfigurable Devices |
Author(s) |
Yeonwoong Jung |
On-Site Speaker (Planned) |
Yeonwoong Jung |
Abstract Scope |
In this talk, I will discuss recent efforts in my group on exploring viable manufacturing strategies to assemble wafer-scale 2D TMD layers of heterogeneously tailored components on arbitrary substrates. Specifically, we grew various 2D TMD layers of controlled layer orientation – i.e. horizontal or vertical layer alignments – on a large wafer scale via a chemical vapor deposition. We, then, precisely peeled off the wafer-scale 2D TMD layers from their original growth wafers within water preserving their intrinsic structural/chemical integrity and heterogeneously integrated them onto substrates of virtually unrestricted kinds and shapes. A range of novel applications benefiting from these atomically-thin wafer-scale materials on unconventional substrates were demonstrated, including multi-dimensionally stretchable photodetectors and electro-mechanical soft actuators. The underlying principle for the successful delamination of the 2D TMD layers will be discussed in the framework of thermodynamic interfacial energy and water-driven capillary force mechanisms. |