| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Printed Electronics and Additive Manufacturing: Advanced Functional Materials, Processing Concepts, and Emerging Applications
|
| Presentation Title |
Dry Printing Pure Copper for Flexile Electronics with High Electrical and Mechanical Performance |
| Author(s) |
Zabihollah Ahmadi, Aarsh Patel, Curtis Hill, Jennifer M. Jones, Steven R. Peeples, Matthew G. Boebinger, Masoud Mahjouri-Samani |
| On-Site Speaker (Planned) |
Masoud Mahjouri-Samani |
| Abstract Scope |
Printed electronics are becoming increasingly attractive due to their design flexibility, rapid manufacturing, and lower cost. The current ink-based printing ecosystem mainly focuses on printing silver as conductive lines due to its matured ink manufacturing process, relatively low sintering temperature, and low oxidation rate. However, due to its high cost and scarcity, copper has become technologically and economically more attractive than silver. Yet, printing copper with ink-based technologies is still a significant challenge due to the higher sintering temperature, higher oxidation rate, and challenging ink formulation processes. Here, I will present the new inkless method for dry printing highly conductive Cu on different substrates. Pure copper nanoparticles (~3-30nm) are generated in situ and laser sintered/printed onto the substrates in real-time. The printed copper lines show high electrical conductivity and mechanical stability under static and cyclic tests. They also demonstrate excellent adhesion to the substrate with great stability over many months. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Additive Manufacturing, Electronic Materials, Copper / Nickel / Cobalt |