Abstract Scope |
Electrical connections between IC chips and printed circuit boards are typically accomplished by wire bonding. Although a mature technology, wire bonds have limitations due to increased package size, potential for damage during handling, and parasitic inductance which limits high frequency performance. With conformal interconnects, the electrical connections are printed with nanoparticle inks and then heated form solid conductive wires up the sidewall of die. Many advantages result including low profile, ultra thin connections, and high density packages. Unlike wire bonds, printed interconnects can be geometrically tailored to optimize impedance matching, with resulting frequency performance exceeding 90 GHz. Aerosol Jet® is a non-contact printing approach that when combined with multi-axis motion can print both metals and dielectrics in 3D multilayer geometries. Specific applications discussed include high density interconnects with 10 m /10 m line/space for display edge connections as well as tapered interconnects for RF filters that operate at 5G frequencies. |