About this Abstract |
Meeting |
2024 TMS Annual Meeting & Exhibition
|
Symposium
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Printed Electronics and Additive Manufacturing: Advanced Functional Materials, Processing Concepts, and Emerging Applications
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Presentation Title |
Binder-based 3d Printing of High-surface Area Copper Electrodes |
Author(s) |
Bruno Azeredo |
On-Site Speaker (Planned) |
Bruno Azeredo |
Abstract Scope |
Nanoporous metals have been proposed as electrodes for hydrogen production, current collectors in batteries, or active material in propellants to overcome limitations in reaction kinetics of their bulk solid counterpart. However, their consolidation into large-scale parts via powder metallurgy while maintaining its mechanical performance is limited by the nanoporous metal’s thermodynamic instability during sintering and their poor flowability in powder-based feedstocks. In this work, the synthesis of spherical nanoporous copper powders (PCu) is undertaken via dealloying of Cu-Al gas-atomized precursors with high-throughput, moderate flowability, moderate-oxygen content, high-surface area and free of precipitates. P-Cu is sintered with powder mixtures containing Cu nanoparticles at temperatures as low as a third of its melting point to overcome its thermodynamic instability and preserve its high-surface area. As an example, open-die casting and micro-projection stereolithography were employed to produce conductive copper parts with low-to-moderate strength with preserved nanoporosity (i.e., pore size 24 – 36 nm). |
Proceedings Inclusion? |
Planned: |
Keywords |
Additive Manufacturing, Nanotechnology, Powder Materials |