About this Abstract |
Meeting |
2024 TMS Annual Meeting & Exhibition
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Symposium
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Printed Electronics and Additive Manufacturing: Advanced Functional Materials, Processing Concepts, and Emerging Applications
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Presentation Title |
In-line Improved Adhesion and Conductivity Characteristics in Plasma-jet Printed Metallic Inks |
Author(s) |
Jacob Manzi, Tony Varghese, Josh Eixenberger, David Estrada, Harish Subbaraman |
On-Site Speaker (Planned) |
Harish Subbaraman |
Abstract Scope |
Additive manufacturing has become a favorable method for the fabrication of inexpensive, flexible electronics such as electro-optic devices, gas sensors, chemical sensors, antennas, energy harvesting and storage devices, and organic thin-film transistors with additive technologies such as inkjet, aerosol-jet, and plasma jet printing (PJP). Silver and copper nanoparticles (NPs) are commonly used for forming conductive traces but are not biocompatible and can suffer from oxidation and loss in performance over time. Gold can be a good alternative but can have inherently poor adhesion in many cases. PJP has an advantage over other methods because it uses a dielectric barrier discharge plasma to focus the aerosolized nanoparticles. In this work, we use modified gold ink and silver ink to show PJP of flexible, conductive, structures with good adhesion and minimal oxidation onto low-temperature substrates without the need for thermal or photonic post-processing, while maintaining temperatures low enough to print on paper. |
Proceedings Inclusion? |
Planned: |
Keywords |
Additive Manufacturing, Electronic Materials, Process Technology |