| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advances in Materials Deposition by Cold Spray and Related Technologies
|
| Presentation Title |
Cold Spray Bonding Improvements of SS316 using Copper Additions |
| Author(s) |
Michael B. Pagan, Styler Goring, HuChun Yi, Aaron Stebner |
| On-Site Speaker (Planned) |
Michael B. Pagan |
| Abstract Scope |
Cold spray additive manufacturing (CSAM) is a promising method of creating near-net shape components while mitigating problems that develop due to thermal cycling. Since it relies on deformation bonding, it is generally limited to components with ductile materials rather than high strength structural materials, as these develop significant porosity from incomplete bonding. Here we demonstrate and analyze the successful CSAM of high strength SS316 components and their associated microstructural evolution. We demonstrate SS316 components with the addition of copper powder as well as a post-print heat treatment. We evaluate the resulting components using two-point image correlation analysis, optical microscopy, electron microscopy, energy dispersive spectroscopy, electron backscatter diffraction, and thermodynamic simulations. We demonstrate the ability to preferentially fill porosity and develop the microstructural features needed for increased strength. Due to the improved ability to bond high strength materials we also demonstrate large cm sized components rather than thin coatings. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Additive Manufacturing, Powder Materials, Characterization |