About this Abstract |
Meeting |
2024 TMS Annual Meeting & Exhibition
|
Symposium
|
Mechanical Behavior at the Nanoscale VII
|
Presentation Title |
Influence of the Structure and Chemistry of Σ5 Grain Boundaries on Microscale Strengthening in Cu Bicrystals |
Author(s) |
Mohammed Kamran Bhat, Tobias Brink, Hui Ding, Chanwon Jung, James Paul Best, Gerhard Dehm |
On-Site Speaker (Planned) |
Mohammed Kamran Bhat |
Abstract Scope |
Grain boundaries (GBs) are crucial determinants for the mechanical properties of polycrystalline materials and traditional models, such as Hall-Petch, treat GBs merely as obstacles. To date, the distinct contributions made by atomic-scale GB structure and chemistry to the mechanical response are not resolved. To address this, we conducted micropillar compression complimented by atomistic simulations on copper Σ5 bicrystals. We show that Ag segregation to a Cu Σ5 GB leads to higher strength values. Also, we highlight the impact of GB structure/energy by comparing deformation behaviour of a symmetric Cu Σ5 (310) and an asymmetric Σ5 (110) (100). While the two GB variants show similar strength at lower strains, the asymmetric variant shows significant softening at higher strains attributed to room temperature GB migration. We finally highlight that not just grain size but GB structure and chemistry are influential parameters, through the deformation mechanisms of nanocrystalline Cu thin-films. |
Proceedings Inclusion? |
Planned: |
Keywords |
Copper / Nickel / Cobalt, Mechanical Properties, Thin Films and Interfaces |