ProgramMaster Logo
Conference Tools for 2020 TMS Annual Meeting & Exhibition
Login
Register as a New User
Help
Submit An Abstract
Propose A Symposium
Presenter/Author Tools
Organizer/Editor Tools
About this Abstract
Meeting 2020 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIX
Presentation Title Effects of Surface Finish on the Interfacial Cu6Sn5 Morphology and Mechanical Characteristics in Solder Joints
Author(s) Wei-Ling Chou, Shu-Ping Yang, Cheng-Yu Lee, Tsai-Tung Kuo, Cheng-En Ho
On-Site Speaker (Planned) Wei-Ling Chou
Abstract Scope Phase formation and transformation in the metallurgical reactions between an 96.5Sn-3Ag-0.5Cu (wt.%) alloy and Cu pads with different surface finishes were systematically investigated. The surface finishes included organic solderability preservative (OSP), immersion Ag, immersion Sn, Au/Pd (EPIG), and Au/Pd/Au (IGEPIG). Cu6Sn5 and Cu3Sn were the predominant intermetallic compound (IMC) species nucleated at the joint interface after reflow(s). Interestingly, the growth morphology of Cu6Sn5 strongly depended on the surface finish type, dominating the mechanical characteristics of the joint interface. Finally, finite element analysis via ANSYS software was conducted to rationalize this interesting finding. Details will be presented in this study.
Proceedings Inclusion? Planned: Supplemental Proceedings volume

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

4D characterization of electromigration-induced grain boundary damage of Cu interconnects: X-ray tomography experiments and phase-field simulations
A Switching Model of Phase-change Memory by Combining Electrothermal and Phase-field Models
A Transient Liquid Phase Bonding Process Using Sn/Cu Multiple layers for Automotive Power Semiconductor
An ab initio study on the structural and electrochemical propeties of Na3V2(PO4)2F3 as cathode materials for hybrid-ion batteries
CALPHAD-assisted Analyses of BOF Slag Modification and Reduction
CALPHAD-assisted Analyses of BOF Slag Recovery
Challenges and Solutions for Experimental Investigation of Air and Moisture Sensitive Li Alloys
Comparison of oxide reduction temperature between highly <111>-oriented nanotwinned Cu and regular Cu films
Direct bonding of pure Al die to Al substrate with Ag flake paste
Effects of copper electroplating parameters on the copper-based solder joint reactions
Effects of current stressing on mechanical property and microstructure of an Fe-Ni alloy at ambient temperature
Effects of Ge/Sb Intermixing on the Local Structures and Optical Properties of GeTe-Sb2Te3 Superlattice
Effects of Pd(P) thickness on the interfacial reaction and mechanical properties of the Sn-3.5Ag/Au/Pd(P)/Ni(P) microelectronic joints
Effects of Plating Current Density on the Microstructure of Cu Pillars and Its Solderability
Effects of Surface Finish on the Interfacial Cu6Sn5 Morphology and Mechanical Characteristics in Solder Joints
Electrodepositon of nanotwinned copper within through silicon via and its reaction with Sn during soldering
Electromigration effect upon single-phase and two-phase Ag-Cu alloy: an in situ study
Electroplating of Rhodium using Pulse Current Plating Method
Fabrication of Highly Reliable Joint Based on Cu@Ni@Sn Double-layer Powder for High Temperature Application
Facile and Scalable Fabrication of Copper Nanoparticles with Superior Antioxidative Properties, Improved Sinterability and their Applications in Electronics
From electric current-induced lattice strain to electromigration occurrence: an in situ study
Full Battery Design for Li-ion Batteries using CALPHAD Technique
High-throughput CALPHAD-type calculation in design of coherent precipitate-strengthening AlCuFeNiTi multi-principal element alloys
In-situ study of electrochemical migration of tin in presence of contaminants
Interfacial Reaction in the Lead-Free Solder/Cu-2.0Be (Alloy 25) Couples
Interfacial Reaction of Au-xAg/Al Couples
Interfacial reactions between lead-free solders and Electroless Co(B) metallization
Interfacial Reactions in the Au/Sn-xZn/Cu Sandwich Couples
Interfacial Reactions in the Cu/Sn/Ni Sandwich Couples
Interfacial Reactions in the Sn/Au-xCu Couples
Interfacial Reactions of Ag-Au-xPd Alloys Wire Bonding with Al
Interfacial stability between high-temperature lead-free solders and substrates
Investigation of metal filament formation
Learning from the Ni3Sn2 for Cu6Sn5
Mechanisms of abnormal grain growth of Al bonding wires under annealing process
Microstructure of Cu/Cu joints using Sn-Coated Cu particle paste for high-temperature application
Nanotwinned Copper Composite with High Strength and High Tensile Ductility
Real-time observation of the accelerated growth of (Cu,Ni)6Sn5 on Cu-xNi current collectors
Revisit the Blech critical product: lattice strain induces electromigration effect
Structure-property relation of glass fiber-PZT composites
Study on Eelectromigration of Cu-Sn IMC Formation Due to Currents Stress and Temperature
Study on the phase diagrams of Bi-Te binary and Bi-Te-RE (Yb, La, Ce, Nd, Sm, Tb, Er) ternary systems
The effect of the Cu preferred orientation on the adhesion between Cu and LCP in FCCL
Thermodynamic modeling of the Cu-Mg-Si-Sn quaternary system and interpretation of Mg2(Si0.3Sn0.7)/Cu thermoelectric interconnections
Wafer Level SLID Bonding - Formation and Evolution of Microstructures
Zn Whisker Growth under High Temperature and Humidity conditions

Questions about ProgramMaster? Contact programming@programmaster.org