|About this Abstract
||2020 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIX
||D-15: Effects of Surface Finish on the Interfacial Cu6Sn5 Morphology and Mechanical Characteristics in Solder Joints
||Wei-Ling Chou, Shu-Ping Yang, Cheng-Yu Lee, Tsai-Tung Kuo, Cheng-En Ho
|On-Site Speaker (Planned)
Phase formation and transformation in the metallurgical reactions between an 96.5Sn-3Ag-0.5Cu (wt.%) alloy and Cu pads with different surface finishes were systematically investigated. The surface finishes included organic solderability preservative (OSP), immersion Ag, immersion Sn, Au/Pd (EPIG), and Au/Pd/Au (IGEPIG). Cu6Sn5 and Cu3Sn were the predominant intermetallic compound (IMC) species nucleated at the joint interface after reflow(s). Interestingly, the growth morphology of Cu6Sn5 strongly depended on the surface finish type, dominating the mechanical characteristics of the joint interface. Finally, finite element analysis via ANSYS software was conducted to rationalize this interesting finding. Details will be presented in this study.
||Planned: Supplemental Proceedings volume