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Meeting 2020 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIX
Presentation Title D-12: Comparison of Oxide Reduction Temperature between Highly <111>-Oriented Nanotwinned Cu and Regular Cu Films
Author(s) Wei-You Hsu, Cheng-Syuan Wu, Chi-Shen Lee, Chih Chen
On-Site Speaker (Planned) Wei-You Hsu
Abstract Scope Low temperature Cu-Cu direct bonding was successfully achieved in 2014 using highly <111>-oriented Cu. [1] Because Cu (111) planes have the highest diffusivity and low oxidation rates, so two highly <111>-oriented Cu films can be bonded at low temperature of 150C and low pressure of 1 MPa. Using forming gas in Cu-Cu bonding process can efficiently decrease the oxygen content in the interface. [2] In this study, we use temperature-programmed reduction (H2-TPR) to reduce the oxide of highly <111>-oriented nanotwinned Cu (nt-Cu). Using thermal conductivity detector (TCD) to detect the consumption of hydrogen and then knowing the reduction temperature of nt-Cu under the reducing atmosphere (5%H2+95%Ar) is about 215C. In contrast, the reduction temperature of regular Cu under the same condition is about 290C.
Proceedings Inclusion? Planned: Supplemental Proceedings volume


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An Ab-initio Study on the Structural and Electrochemical Propeties of Na3V2(PO4)2F3 as Cathode Materials for Hybrid-ion Batteries
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D-10: A Switching Model of Phase-change Memory by Combining Electrothermal and Phase-field Models
D-11: CALPHAD-assisted Analyses of BOF Slag Recovery
D-12: Comparison of Oxide Reduction Temperature between Highly <111>-Oriented Nanotwinned Cu and Regular Cu Films
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D-14: Effects of Plating Current Density on the Microstructure of Cu Pillars and Its Solderability
D-15: Effects of Surface Finish on the Interfacial Cu6Sn5 Morphology and Mechanical Characteristics in Solder Joints
D-16: From Electric Current-induced Lattice Strain to Electromigration Occurrence: An In-situ Study
D-17: Interfacial Reaction of Au-xAg/Al Couples
D-18: Interfacial Reactions in the Au/Sn-xZn/Cu Sandwich Couples
D-19: Interfacial Reactions in the Cu/Sn/Ni Sandwich Couples
D-20: Interfacial Reactions in the Sn/Au-xCu Couples
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Investigation of Metal Filament Formation
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Revisit the Blech Critical Product: Lattice Strain Induces Electromigration Effect
Study on Eelectromigration of Cu-Sn IMC Formation Due to Currents Stress and Temperature
Study on the Phase Diagrams of Bi-Te Binary and Bi-Te-RE (Yb, La, Ce, Nd, Sm, Tb, Er) Ternary Systems
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