|About this Abstract
||2020 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIX
||Wafer Level SLID Bonding - Formation and Evolution of Microstructures
||Vesa Vuorinen, Glenn Ross, Joseph Hotskiss, Jani Pöllänen, Mervi Paulasto-Kröckel
|On-Site Speaker (Planned)
Wafer level Solid Liquid Interdiffusion (SLID) bonding, also known as Transient Liquid-Phase (TLP) bonding, is becoming an increasingly attractive method for industrial usage since it can provide simultaneous formation of electrical interconnections and hermetic encapsulation for Micro Electro Mechanical Systems (MEMS). However, in order to ensure the functionality and reliability of the devices fundamental understanding on the formation and evolution of interconnection microstructures as well as global and local stresses is of utmost importance. In this work a low-temperature Cu-In-Sn based SLID bonding process is presented and discussed in detail. It was discovered that by introducing In as an additional alloying element to the traditional Cu-Sn metallurgy, resulting in a stabilized Cu6(Sn,In)5 phase structure, it is possible to significantly decrease the bonding temperature. The CTE induced residual stresses are minimized due to reduced process temperatures. In addition, the challenges related to the process integration and MEMS/CMOS device compatibility is rationalized.
||Planned: Supplemental Proceedings volume