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Meeting 2020 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIX
Presentation Title Wafer Level SLID Bonding - Formation and Evolution of Microstructures
Author(s) Vesa Vuorinen, Glenn Ross, Joseph Hotskiss, Jani Pöllänen, Mervi Paulasto-Kröckel
On-Site Speaker (Planned) Vesa Vuorinen
Abstract Scope Wafer level Solid Liquid Interdiffusion (SLID) bonding, also known as Transient Liquid-Phase (TLP) bonding, is becoming an increasingly attractive method for industrial usage since it can provide simultaneous formation of electrical interconnections and hermetic encapsulation for Micro Electro Mechanical Systems (MEMS). However, in order to ensure the functionality and reliability of the devices fundamental understanding on the formation and evolution of interconnection microstructures as well as global and local stresses is of utmost importance. In this work a low-temperature Cu-In-Sn based SLID bonding process is presented and discussed in detail. It was discovered that by introducing In as an additional alloying element to the traditional Cu-Sn metallurgy, resulting in a stabilized Cu6(Sn,In)5 phase structure, it is possible to significantly decrease the bonding temperature. The CTE induced residual stresses are minimized due to reduced process temperatures. In addition, the challenges related to the process integration and MEMS/CMOS device compatibility is rationalized.
Proceedings Inclusion? Planned: Supplemental Proceedings volume


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CALPHAD-assisted Analyses of BOF Slag Modification and Reduction
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D-10: A Switching Model of Phase-change Memory by Combining Electrothermal and Phase-field Models
D-11: CALPHAD-assisted Analyses of BOF Slag Recovery
D-12: Comparison of Oxide Reduction Temperature between Highly <111>-Oriented Nanotwinned Cu and Regular Cu Films
D-13: Effects of Current Stressing on Mechanical Property and Microstructure of an Fe-Ni Alloy at Ambient Temperature
D-14: Effects of Plating Current Density on the Microstructure of Cu Pillars and Its Solderability
D-15: Effects of Surface Finish on the Interfacial Cu6Sn5 Morphology and Mechanical Characteristics in Solder Joints
D-16: From Electric Current-induced Lattice Strain to Electromigration Occurrence: An In-situ Study
D-17: Interfacial Reaction of Au-xAg/Al Couples
D-18: Interfacial Reactions in the Au/Sn-xZn/Cu Sandwich Couples
D-19: Interfacial Reactions in the Cu/Sn/Ni Sandwich Couples
D-20: Interfacial Reactions in the Sn/Au-xCu Couples
D-21: Interfacial Reactions of Ag-Au-xPd Alloys Wire Bonding with Al
D-22: Mechanisms of Abnormal Grain Growth of Al Bonding Wires under Annealing Process
Effects of Copper Electroplating Parameters on the Copper-based Solder Joint Reactions
Effects of Pd(P) Thickness on the Interfacial Reaction and Mechanical Properties of the Sn-3.5Ag/Au/Pd(P)/Ni(P) Microelectronic Joints
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Interfacial Stability between High-temperature Lead-free Solders and Substrates
Investigation of Metal Filament Formation
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Real-time Observation of the Accelerated Growth of (Cu,Ni)6Sn5 on Cu-xNi Current Collectors
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Study on Eelectromigration of Cu-Sn IMC Formation Due to Currents Stress and Temperature
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