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Meeting 2020 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIX
Presentation Title Microstructure of Cu/Cu Joints using Sn-Coated Cu Particle Paste for High-temperature Application
Author(s) Hiroshi Nishikawa, Xiangdong Liu
On-Site Speaker (Planned) Hiroshi Nishikawa
Abstract Scope To assemble power modules for high-temperature application, the high temperature packaging technology such as a die attach process has been required. As a die attach process, we focus on a transient liquid phase (TLP) bonding, which can be operated at a low temperature while resulting in higher re-melting temperatures of bonded joints. However, some drawbacks of this technology still remain. For example, the duration of this process is too long, up to a few hours, and multiple hours of annealing are required to achieve a thermodynamically stable joint. In this time, we evaluate the microstructure of the joints using Sn-coated Cu particles and the bonding strength of the joints. A thermally stable joint fully comprising Cu3Sn phase with a dispersion of Cu particles could be obtained after sintering for 30 s at 300 ℃ under a formic acid atmosphere. The shear strength of the joint was about 25 MPa.
Proceedings Inclusion? Planned: Supplemental Proceedings volume

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

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CALPHAD-assisted Analyses of BOF Slag Modification and Reduction
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D-10: A Switching Model of Phase-change Memory by Combining Electrothermal and Phase-field Models
D-11: CALPHAD-assisted Analyses of BOF Slag Recovery
D-12: Comparison of Oxide Reduction Temperature between Highly <111>-Oriented Nanotwinned Cu and Regular Cu Films
D-13: Effects of Current Stressing on Mechanical Property and Microstructure of an Fe-Ni Alloy at Ambient Temperature
D-14: Effects of Plating Current Density on the Microstructure of Cu Pillars and Its Solderability
D-15: Effects of Surface Finish on the Interfacial Cu6Sn5 Morphology and Mechanical Characteristics in Solder Joints
D-16: From Electric Current-induced Lattice Strain to Electromigration Occurrence: An In-situ Study
D-17: Interfacial Reaction of Au-xAg/Al Couples
D-18: Interfacial Reactions in the Au/Sn-xZn/Cu Sandwich Couples
D-19: Interfacial Reactions in the Cu/Sn/Ni Sandwich Couples
D-20: Interfacial Reactions in the Sn/Au-xCu Couples
D-21: Interfacial Reactions of Ag-Au-xPd Alloys Wire Bonding with Al
D-22: Mechanisms of Abnormal Grain Growth of Al Bonding Wires under Annealing Process
Effects of Copper Electroplating Parameters on the Copper-based Solder Joint Reactions
Effects of Pd(P) Thickness on the Interfacial Reaction and Mechanical Properties of the Sn-3.5Ag/Au/Pd(P)/Ni(P) Microelectronic Joints
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