| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIX
|
| Presentation Title |
Learning from the Ni3Sn2 for Cu6Sn5 |
| Author(s) |
Andreas Leineweber, Christian Wieser, Werner Hügel |
| On-Site Speaker (Planned) |
Andreas Leineweber |
| Abstract Scope |
Eta-Cu6Sn5 is one of the main intermetallic phases forming during soldering of Cu base alloys using Sn base solders. It is based on a Ni2In/NiAs type, where differently ordered states have been reported for Cu6Sn5 (or “Cu5Sn4”), have, however, only incompletely reconciled with the Cu-Sn phase diagram. We present new details on the Cu-Sn phase diagram, especially as determined from precisely measured lattice parameter data of Cu6Sn5 in its ordered and disordered state. This reveals insight on the compositions of the differently ordered states. The observations are, in particular, compared with findings for structurally similar Ni3Sn2 from the Ni-Sn system. In contrast to Cu6Sn5, that Ni-Sn intermetallic has a wide homogeneity range with pronounced structural effects due to the different ordered states. These differences makes Ni3Sn2 a good model system to study effects, which are much more subtle in Cu6Sn5. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |