|About this Abstract
||2020 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIX
||D-19: Interfacial Reactions in the Cu/Sn/Ni Sandwich Couples
||Cheng-Han Lee, Shih-Jung Chai, Yee-Wen Yen
|On-Site Speaker (Planned)
A soldering technique is commonly used to connect chip and chip in 3D IC packaging. Three different couples: Cu/Sn(5 m)/Ni, Cu/Sn(10 m)/Ni and Cu/Sn(15 m)/Ni were prepare to investigated interfacial reactions in the Cu/Sn/Ni sandwich couples . All couples were reflowed at 250oC for 1, 3 and 5 min then aged at 180oC up to 300 h.
The results show that the complete Sn layer consumption time was increased with the increase of the Sn layer thickness for the same reflowing condition. The Cu6Sn5 phase was gradually transferred to the Cu3Sn phase, and Ni3Sn4 phase was disappeared when the aging time was increased. Meanwhile, the Cu3Sn thickness was increased with the increase of aged time and no Ni atom was observed in Cu3Sn phase for 300-h aging. The (Cu, Ni)6Sn5 phase acted the diffusion barrier to prevent Ni atom diffusion toward the Cu side.
||Planned: Supplemental Proceedings volume