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Meeting 2020 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIX
Presentation Title In-situ study of electrochemical migration of tin in presence of contaminants
Author(s) A.S.Md Abdul Haseeb, Ee Lynn Lee, Yi Sing Goh, Y. H. Wong, M. F. M. Sabri, B. Y. Low
On-Site Speaker (Planned) A.S.Md Abdul Haseeb
Abstract Scope As the pitch size in electronic packages decreases due to miniaturization, problems related to electrochemical migration (ECM) become a serious reliability concern. ECM is an electrochemical reaction that occurs in presence of electrolyte and bias voltage, causing metallic components to dissolve at the anode and redeposit at the cathode in the form of dendrites leading to short circuit failure. Contaminants originating from manufacturing process steps, flux residue and environment accelerate the process. This work investigates ECM process of tin in the presence of different contaminants e.g., bromide and adipic acid. Water drop test (WDT) was conducted in the two-probe semiconductor characterization system under a high-power optical microscope for the in-situ investigation. The products of ECM such as dendrites and precipitates were characterized by SEM/ EDX and XPS. The effects of different contaminants on the mean time to failure and the mechanism of ECM are discussed.
Proceedings Inclusion? Planned: Supplemental Proceedings volume

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Effects of Plating Current Density on the Microstructure of Cu Pillars and Its Solderability
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Interfacial Reaction in the Lead-Free Solder/Cu-2.0Be (Alloy 25) Couples
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Interfacial Reactions of Ag-Au-xPd Alloys Wire Bonding with Al
Interfacial stability between high-temperature lead-free solders and substrates
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