|About this Abstract
||2020 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIX
||Study on Eelectromigration of Cu-Sn IMC Formation Due to Currents Stress and Temperature
||Chao-Chi Huang , Po Hsun Wang , Ming-Tzer Lin
|On-Site Speaker (Planned)
In this study, the investigation of electromigration due to temperature and currents stress effects between tin/copper substrate were performed. Experiments were tested during heating (130℃ and 180℃); heating and different current stress. We observed micro-structural changes on intermetallic compound (IMC) formation and evaluated the defects (brittle cracks, voids, bumps, etc.) on the IMC. The IMC formation results show that IMC thickness increases with increasing heating time and current stress. However, when tested under the combination of both heating and current stress, the IMC between the solder and the copper substrate exhibits some defects. By adjusting sample geometry, the density of the current stress on different cross-section can reduce the failure phenomenon, such as the signal delay, distortion and short circuit that usually appears after the long-term use of the material components. Detail IMC growth mechanism and defect formation were closely study and discussed.
||Planned: Supplemental Proceedings volume