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Meeting 2020 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIX
Presentation Title Study on Eelectromigration of Cu-Sn IMC Formation Due to Currents Stress and Temperature
Author(s) Chao-Chi Huang , Po Hsun Wang , Ming-Tzer Lin
On-Site Speaker (Planned) Ming-Tzer Lin
Abstract Scope In this study, the investigation of electromigration due to temperature and currents stress effects between tin/copper substrate were performed. Experiments were tested during heating (130℃ and 180℃); heating and different current stress. We observed micro-structural changes on intermetallic compound (IMC) formation and evaluated the defects (brittle cracks, voids, bumps, etc.) on the IMC. The IMC formation results show that IMC thickness increases with increasing heating time and current stress. However, when tested under the combination of both heating and current stress, the IMC between the solder and the copper substrate exhibits some defects. By adjusting sample geometry, the density of the current stress on different cross-section can reduce the failure phenomenon, such as the signal delay, distortion and short circuit that usually appears after the long-term use of the material components. Detail IMC growth mechanism and defect formation were closely study and discussed.
Proceedings Inclusion? Planned: Supplemental Proceedings volume

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

4D characterization of electromigration-induced grain boundary damage of Cu interconnects: X-ray tomography experiments and phase-field simulations
A Switching Model of Phase-change Memory by Combining Electrothermal and Phase-field Models
A Transient Liquid Phase Bonding Process Using Sn/Cu Multiple layers for Automotive Power Semiconductor
An ab initio study on the structural and electrochemical propeties of Na3V2(PO4)2F3 as cathode materials for hybrid-ion batteries
CALPHAD-assisted Analyses of BOF Slag Modification and Reduction
CALPHAD-assisted Analyses of BOF Slag Recovery
Challenges and Solutions for Experimental Investigation of Air and Moisture Sensitive Li Alloys
Comparison of oxide reduction temperature between highly <111>-oriented nanotwinned Cu and regular Cu films
Direct bonding of pure Al die to Al substrate with Ag flake paste
Effects of copper electroplating parameters on the copper-based solder joint reactions
Effects of current stressing on mechanical property and microstructure of an Fe-Ni alloy at ambient temperature
Effects of Ge/Sb Intermixing on the Local Structures and Optical Properties of GeTe-Sb2Te3 Superlattice
Effects of Pd(P) thickness on the interfacial reaction and mechanical properties of the Sn-3.5Ag/Au/Pd(P)/Ni(P) microelectronic joints
Effects of Plating Current Density on the Microstructure of Cu Pillars and Its Solderability
Effects of Surface Finish on the Interfacial Cu6Sn5 Morphology and Mechanical Characteristics in Solder Joints
Electrodepositon of nanotwinned copper within through silicon via and its reaction with Sn during soldering
Electromigration effect upon single-phase and two-phase Ag-Cu alloy: an in situ study
Electroplating of Rhodium using Pulse Current Plating Method
Fabrication of Highly Reliable Joint Based on Cu@Ni@Sn Double-layer Powder for High Temperature Application
Facile and Scalable Fabrication of Copper Nanoparticles with Superior Antioxidative Properties, Improved Sinterability and their Applications in Electronics
From electric current-induced lattice strain to electromigration occurrence: an in situ study
Full Battery Design for Li-ion Batteries using CALPHAD Technique
High-throughput CALPHAD-type calculation in design of coherent precipitate-strengthening AlCuFeNiTi multi-principal element alloys
In-situ study of electrochemical migration of tin in presence of contaminants
Interfacial Reaction in the Lead-Free Solder/Cu-2.0Be (Alloy 25) Couples
Interfacial Reaction of Au-xAg/Al Couples
Interfacial reactions between lead-free solders and Electroless Co(B) metallization
Interfacial Reactions in the Au/Sn-xZn/Cu Sandwich Couples
Interfacial Reactions in the Cu/Sn/Ni Sandwich Couples
Interfacial Reactions in the Sn/Au-xCu Couples
Interfacial Reactions of Ag-Au-xPd Alloys Wire Bonding with Al
Interfacial stability between high-temperature lead-free solders and substrates
Investigation of metal filament formation
Learning from the Ni3Sn2 for Cu6Sn5
Mechanisms of abnormal grain growth of Al bonding wires under annealing process
Microstructure of Cu/Cu joints using Sn-Coated Cu particle paste for high-temperature application
Nanotwinned Copper Composite with High Strength and High Tensile Ductility
Real-time observation of the accelerated growth of (Cu,Ni)6Sn5 on Cu-xNi current collectors
Revisit the Blech critical product: lattice strain induces electromigration effect
Structure-property relation of glass fiber-PZT composites
Study on Eelectromigration of Cu-Sn IMC Formation Due to Currents Stress and Temperature
Study on the phase diagrams of Bi-Te binary and Bi-Te-RE (Yb, La, Ce, Nd, Sm, Tb, Er) ternary systems
The effect of the Cu preferred orientation on the adhesion between Cu and LCP in FCCL
Thermodynamic modeling of the Cu-Mg-Si-Sn quaternary system and interpretation of Mg2(Si0.3Sn0.7)/Cu thermoelectric interconnections
Wafer Level SLID Bonding - Formation and Evolution of Microstructures
Zn Whisker Growth under High Temperature and Humidity conditions

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