|About this Abstract
||2020 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIX
||D-18: Interfacial Reactions in the Au/Sn-xZn/Cu Sandwich Couples
||Yi-Show Lin, Yi-Pin Wu, Yee-Wen Yen
|On-Site Speaker (Planned)
The Sn-xZn alloys (1.0 mm thickness) were reacted with Cu substrate at 270°C for 1 h then clamped together over an Au foil to form the Au/Sn-xZn/Cu sandwich couples. Au-Sn intermetallic compounds (IMCs) were formed at the Sn-1Zn/Au interface for 160°C and 20-h aging. The Cu6Sn5 phase was observed which revealed that Cu atoms rapidly diffused through the Sn-1Zn solder. Au-Sn, Au-Zn IMCs, and an Au-Sn-Zn ternary metastable phase were formed at the Sn-xZn/Au interface (x=5 and 9 wt.%). Only Au-Zn IMCs were formed when Zn contents were more than 20 wt.%. On Cu side, the (Cu, Zn)6Sn5, (Cu, Sn)Zn phases at the Sn-1Zn/Cu interface, the Cu5Zn8 phase at the Sn-5Zn/Cu interface and the (Cu, Sn)5Zn8, (Cu, Sn)Zn5 phases at the Sn-xZn/Cu interfaces (x=9, 20 and 40 wt.%) were observed. The results indicated that IMC formation in the Au side strongly depended on the Zn concentration in the Sn-xZn alloys.
||Planned: Supplemental Proceedings volume