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Meeting 2020 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIX
Presentation Title D-18: Interfacial Reactions in the Au/Sn-xZn/Cu Sandwich Couples
Author(s) Yi-Show Lin, Yi-Pin Wu, Yee-Wen Yen
On-Site Speaker (Planned) Yi-Show Lin
Abstract Scope The Sn-xZn alloys (1.0 mm thickness) were reacted with Cu substrate at 270C for 1 h then clamped together over an Au foil to form the Au/Sn-xZn/Cu sandwich couples. Au-Sn intermetallic compounds (IMCs) were formed at the Sn-1Zn/Au interface for 160C and 20-h aging. The Cu6Sn5 phase was observed which revealed that Cu atoms rapidly diffused through the Sn-1Zn solder. Au-Sn, Au-Zn IMCs, and an Au-Sn-Zn ternary metastable phase were formed at the Sn-xZn/Au interface (x=5 and 9 wt.%). Only Au-Zn IMCs were formed when Zn contents were more than 20 wt.%. On Cu side, the (Cu, Zn)6Sn5, (Cu, Sn)Zn phases at the Sn-1Zn/Cu interface, the Cu5Zn8 phase at the Sn-5Zn/Cu interface and the (Cu, Sn)5Zn8, (Cu, Sn)Zn5 phases at the Sn-xZn/Cu interfaces (x=9, 20 and 40 wt.%) were observed. The results indicated that IMC formation in the Au side strongly depended on the Zn concentration in the Sn-xZn alloys.
Proceedings Inclusion? Planned: Supplemental Proceedings volume

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

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CALPHAD-assisted Analyses of BOF Slag Modification and Reduction
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D-10: A Switching Model of Phase-change Memory by Combining Electrothermal and Phase-field Models
D-11: CALPHAD-assisted Analyses of BOF Slag Recovery
D-12: Comparison of Oxide Reduction Temperature between Highly <111>-Oriented Nanotwinned Cu and Regular Cu Films
D-13: Effects of Current Stressing on Mechanical Property and Microstructure of an Fe-Ni Alloy at Ambient Temperature
D-14: Effects of Plating Current Density on the Microstructure of Cu Pillars and Its Solderability
D-15: Effects of Surface Finish on the Interfacial Cu6Sn5 Morphology and Mechanical Characteristics in Solder Joints
D-16: From Electric Current-induced Lattice Strain to Electromigration Occurrence: An In-situ Study
D-17: Interfacial Reaction of Au-xAg/Al Couples
D-18: Interfacial Reactions in the Au/Sn-xZn/Cu Sandwich Couples
D-19: Interfacial Reactions in the Cu/Sn/Ni Sandwich Couples
D-20: Interfacial Reactions in the Sn/Au-xCu Couples
D-21: Interfacial Reactions of Ag-Au-xPd Alloys Wire Bonding with Al
D-22: Mechanisms of Abnormal Grain Growth of Al Bonding Wires under Annealing Process
Effects of Copper Electroplating Parameters on the Copper-based Solder Joint Reactions
Effects of Pd(P) Thickness on the Interfacial Reaction and Mechanical Properties of the Sn-3.5Ag/Au/Pd(P)/Ni(P) Microelectronic Joints
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Interfacial Reaction in the Lead-free Solder/Cu-2.0Be (Alloy 25) Couples
Interfacial Reactions between Lead-free Solders and Electroless Co(B) Metallization
Interfacial Stability between High-temperature Lead-free Solders and Substrates
Investigation of Metal Filament Formation
Learning from the Ni3Sn2 for Cu6Sn5
Microstructure of Cu/Cu Joints using Sn-Coated Cu Particle Paste for High-temperature Application
Real-time Observation of the Accelerated Growth of (Cu,Ni)6Sn5 on Cu-xNi Current Collectors
Revisit the Blech Critical Product: Lattice Strain Induces Electromigration Effect
Study on Eelectromigration of Cu-Sn IMC Formation Due to Currents Stress and Temperature
Study on the Phase Diagrams of Bi-Te Binary and Bi-Te-RE (Yb, La, Ce, Nd, Sm, Tb, Er) Ternary Systems
The Effect of the Cu Preferred Orientation on the Adhesion between Cu and LCP in FCCL
Thermodynamic Modeling of the Cu-Mg-Si-Sn Quaternary System and Interpretation of Mg2(Si0.3Sn0.7)/Cu Thermoelectric Interconnections
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