About this Abstract |
Meeting |
2024 TMS Annual Meeting & Exhibition
|
Symposium
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Materials Processing and Kinetic Phenomena: From Thin Films and Micro/Nano Systems to Advanced Manufacturing
|
Presentation Title |
Relating Residual Stress Evolution to the Processes of Thin Film Growth |
Author(s) |
Eric Chason, Tong Su |
On-Site Speaker (Planned) |
Eric Chason |
Abstract Scope |
Stress in thin films can significantly impact their performance and lifetime. Many studies show that it is intimately connected to the processing conditions and microstructural evolution. Therefore, a fundamental understanding of the connection between stress and the underlying kinetic processes would enable us to determine the parameters that control the stress and manipulate them to obtain a desired stress state. We have developed a kinetic model that relates the stress evolution to the processes controlling film growth. It includes the effects of non-energetic growth (through surface diffusion and grain boundary formation), subsurface grain growth and energetic particle bombardment. Examples show how the model can analyze multiple sets of wafer curvature measurements to derive kinetic parameters that can predict the stress under different processing conditions. The model has been developed into a user-friendly program that can be used by the thin film growth community to analyze their own stress measurements. |
Proceedings Inclusion? |
Planned: |
Keywords |
Thin Films and Interfaces, Surface Modification and Coatings, Mechanical Properties |